18352494. BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract (CANON KABUSHIKI KAISHA)

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BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD

Organization Name

CANON KABUSHIKI KAISHA

Inventor(s)

ISSEI Funayoshi of Tochigi (JP)

BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18352494 titled 'BONDING APPARATUS, BONDING METHOD, ESTIMATION METHOD, AND ARTICLE MANUFACTURING METHOD

Simplified Explanation

The present invention is a bonding apparatus designed to bond two members together. The first member has a first bonding surface with a first pattern, and the second member has a second bonding surface with a second pattern. The apparatus includes a first image capturing device that captures an image of the first bonding surface, and a second image capturing device that captures an image of the second bonding surface. A controller is used to control the bonding process by aligning the first and second members based on the positions of the first and second patterns obtained from the captured images.

  • The bonding apparatus captures images of the bonding surfaces of the two members.
  • The controller uses the captured images to determine the positions of the patterns on each surface.
  • The first and second members are aligned based on the positions of the patterns.
  • The second member is bonded to the first member.

Potential applications of this technology:

  • Manufacturing industry: This bonding apparatus can be used in various manufacturing processes where precise alignment and bonding of two members are required, such as in electronics assembly, semiconductor manufacturing, and optical device fabrication.
  • 3D printing: The bonding apparatus can be integrated into 3D printers to ensure accurate alignment and bonding of printed parts, improving the overall quality and strength of the printed objects.
  • Medical devices: This technology can be utilized in the production of medical devices, ensuring precise alignment and bonding of components, which is crucial for the functionality and reliability of the devices.

Problems solved by this technology:

  • Precise alignment: The bonding apparatus solves the problem of aligning two members accurately, ensuring that the patterns on each surface are properly matched.
  • Efficient bonding process: By using image capturing devices and a controller, the bonding process can be automated and streamlined, reducing the time and effort required for manual alignment and bonding.
  • Improved bond strength: The precise alignment achieved by this technology results in stronger and more reliable bonds between the two members, reducing the risk of failure or detachment.

Benefits of this technology:

  • Increased productivity: The automation and efficiency of the bonding process lead to higher productivity in manufacturing operations.
  • Improved product quality: The precise alignment and bonding achieved by this technology result in higher quality products with better performance and reliability.
  • Cost savings: By reducing the need for manual alignment and rework, this technology helps to minimize production costs and waste.


Original Abstract Submitted

The present invention provides a bonding apparatus for bonding, to a first member including a first bonding surface on which a first pattern is provided, a second member including a second bonding surface on which a second pattern is provided, comprising: a first image capturing device configured to capture an image of the first bonding surface; a second image capturing device configured to capture an image of the second bonding surface; and a controller configured to control a bonding process of aligning the first member and the second member based on a position of the first pattern obtained from the captured image by the first image capturing device and a position of the second pattern obtained from the captured image by the second image capturing device, and bonding the second member to the first member.

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