18352177. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
HYUNGGIL Baek of Suwon-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18352177 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a lower substrate with contact and non-contact regions, a first upper substrate, a lower device, solder balls, capacitors, and support blocks.
- The lower substrate has distinct contact and non-contact regions.
- A first upper substrate is positioned on the lower substrate.
- A lower device is mounted on the first upper substrate.
- Solder balls are placed between the first upper substrate and the lower substrate's contact region.
- Capacitors are located between the first upper substrate and the lower substrate's non-contact region.
- Support blocks are positioned between the capacitors and the lower substrate's non-contact region.
Potential Applications: - This technology can be used in various semiconductor packaging applications. - It can enhance the performance and reliability of electronic devices.
Problems Solved: - Provides a structured and efficient way to package semiconductor components. - Helps in improving the thermal management of electronic devices.
Benefits: - Improved reliability and performance of semiconductor packages. - Enhanced thermal dissipation capabilities. - Structured design for efficient assembly and manufacturing processes.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Performance This technology can be utilized in the manufacturing of consumer electronics, automotive electronics, and industrial equipment, among other applications. It can lead to more reliable and efficient electronic devices, thus appealing to a wide range of industries.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the thermal management of electronic devices?
- This technology enhances thermal dissipation by providing a structured design with capacitors and support blocks for efficient heat transfer.
2. What are the potential cost implications of implementing this advanced semiconductor packaging technology?
- The initial investment in implementing this technology may be higher, but the long-term benefits in terms of improved reliability and performance can outweigh the costs.
Original Abstract Submitted
A semiconductor package includes a lower substrate that has a contact region and a non-contact region, a first upper substrate on the lower substrate, a lower device on the first upper substrate, a plurality of first solder balls between the first upper substrate and the lower substrate contact region, a plurality of capacitors between the first upper substrate and the lower substrate non-contact region, and a plurality of support blocks between the plurality of capacitors and the lower substrate non-contact region.
