18348011. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18348011 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
The semiconductor package described in the patent application includes a substrate, a first semiconductor chip, a second semiconductor chip, and a bridge chip connecting the two semiconductor chips.
- The first semiconductor chip and the second semiconductor chip are mounted on the substrate, with the bridge chip positioned between them to facilitate electrical connection.
- The first semiconductor chip has a chip pad on its lateral surface, while the bridge chip has a connection pad on one of its surfaces.
- The chip pad and the connection pad are made of the same material and are bonded together to form an integral piece.
Potential Applications: - This technology can be used in various electronic devices that require compact and efficient semiconductor packaging. - It can be applied in industries such as consumer electronics, telecommunications, and automotive electronics.
Problems Solved: - The technology addresses the need for improved semiconductor packaging solutions that offer better electrical connectivity and space efficiency. - It solves the challenge of connecting multiple semiconductor chips on a single substrate in a reliable and compact manner.
Benefits: - Enhanced electrical connectivity between semiconductor chips. - Space-efficient design for compact electronic devices. - Improved reliability and performance of semiconductor packages.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Compact Electronic Devices This technology can be utilized in the development of smartphones, tablets, IoT devices, and other compact electronic gadgets. The market implications include increased efficiency, reduced size, and improved performance of electronic devices.
Prior Art: Readers can explore prior art related to semiconductor packaging technologies, such as multi-chip modules and stacked die packages, to understand the evolution of compact semiconductor packaging solutions.
Frequently Updated Research: Researchers are continuously exploring advancements in semiconductor packaging technologies to enhance the performance and efficiency of electronic devices. Stay updated on the latest research in this field to leverage cutting-edge innovations.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve electrical connectivity between chips? 2. What are the key advantages of using a bridge chip in semiconductor packaging?
Original Abstract Submitted
Disclosed are semiconductor packages and fabrication methods thereof. The semiconductor package includes a substrate, a first semiconductor chip and a second semiconductor chip that are mounted on the substrate, and a bridge chip between a first lateral surface of the first semiconductor chip and a second lateral surface of the second semiconductor chip. The first semiconductor chip and the second semiconductor chip are electrically connected through the bridge chip. The first semiconductor chip includes a first chip pad on the first lateral surface. The bridge chip includes a first connection pad on a first surface of the bridge chip. The first lateral surface of the first semiconductor chip and the first surface of the bridge chip are in contact with each other. The first chip pad and the first connection pad include a same material and are bonded to each other to constitute an integral piece formed.
