18347313. Liquid Immersion-Cooled Power Module simplified abstract (Kia Corporation)
Contents
Liquid Immersion-Cooled Power Module
Organization Name
Inventor(s)
Suk Hyun Lim of Hwaseong-si (KR)
Sang Hun Lee of Hwaseong-si (KR)
Jun Hee Park of Hwaseong-si (KR)
Liquid Immersion-Cooled Power Module - A simplified explanation of the abstract
This abstract first appeared for US patent application 18347313 titled 'Liquid Immersion-Cooled Power Module
The embodiment liquid immersion-cooled power module described in the patent application consists of an enclosure filled with an insulating liquid, a substrate with cooling fins in thermal contact with the liquid, and a chip inside the enclosure.
- The power module includes a connection body that electrically connects multiple substrates to each other.
- The cooling fins on the substrate enhance heat dissipation and improve the overall efficiency of the power module.
- The use of insulating liquid helps in maintaining optimal operating temperatures for the chip and other components.
- The connection body facilitates seamless communication between different substrates, enabling coordinated functioning of the power module.
- The design of the power module allows for effective cooling and efficient power management in various applications.
Potential Applications: - Data centers - High-performance computing - Electric vehicles - Renewable energy systems
Problems Solved: - Overheating of power modules - Inefficient cooling mechanisms - Limited scalability in power systems
Benefits: - Improved thermal management - Enhanced performance and reliability - Energy efficiency - Scalability and flexibility in design
Commercial Applications: Title: Liquid Immersion-Cooled Power Modules: Revolutionizing Thermal Management in High-Performance Systems This technology can be utilized in data centers, electric vehicles, and renewable energy systems to optimize power management and enhance overall performance.
Questions about Liquid Immersion-Cooled Power Modules:
1. How does the use of insulating liquid improve the efficiency of the power module? The insulating liquid helps in maintaining optimal operating temperatures for the chip and other components, leading to improved performance and reliability.
2. What are the potential applications of liquid immersion-cooled power modules? Liquid immersion-cooled power modules can be used in data centers, high-performance computing, electric vehicles, and renewable energy systems to enhance thermal management and overall efficiency.
Original Abstract Submitted
An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.
