18347313. Liquid Immersion-Cooled Power Module simplified abstract (Hyundai Motor Company)
Contents
Liquid Immersion-Cooled Power Module
Organization Name
Inventor(s)
Suk Hyun Lim of Hwaseong-si (KR)
Sang Hun Lee of Hwaseong-si (KR)
Jun Hee Park of Hwaseong-si (KR)
Liquid Immersion-Cooled Power Module - A simplified explanation of the abstract
This abstract first appeared for US patent application 18347313 titled 'Liquid Immersion-Cooled Power Module
Simplified Explanation: The liquid immersion-cooled power module described in the patent application includes an enclosure filled with insulating liquid, a substrate with cooling fins in thermal contact with the liquid, and a chip inside the enclosure.
- The power module is designed to be cooled by immersing it in a liquid, improving heat dissipation and overall performance.
- The substrate inside the enclosure has cooling fins that enhance the thermal contact with the insulating liquid, facilitating efficient cooling of the chip.
- A connection body is included to electrically connect multiple substrates, enabling the integration of multiple power modules for enhanced functionality.
Potential Applications: - Data centers - High-performance computing - Electric vehicles - Renewable energy systems
Problems Solved: - Overheating of power modules - Inefficient cooling systems - Space constraints in cooling solutions
Benefits: - Improved heat dissipation - Enhanced performance and reliability - Space-saving design - Energy efficiency
Commercial Applications: The liquid immersion-cooled power module can be utilized in various industries such as data centers, electric vehicles, and renewable energy systems. Its efficient cooling system and space-saving design make it a valuable solution for high-performance computing applications.
Questions about Liquid Immersion-Cooled Power Module: 1. How does the liquid immersion cooling system improve the performance of the power module? 2. What are the potential cost savings associated with using liquid immersion cooling technology?
Frequently Updated Research: Ongoing research focuses on optimizing the design of liquid immersion-cooled power modules for different applications and improving the overall efficiency of the cooling system.
Original Abstract Submitted
An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.
