18346921. CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Questions about Chip Stack Structure
- 1.10 Original Abstract Submitted
CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Junhyoung Kim of Suwon-si (KR)
CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18346921 titled 'CHIP STACK STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The patent application describes a chip stack structure consisting of two semiconductor chips bonded together, as well as a semiconductor package containing multiple stacked chip stack structures.
- The invention involves a unique chip stack structure with two semiconductor chips bonded vertically.
- The semiconductor package includes multiple chip stack structures stacked on top of each other.
- This innovation aims to improve the efficiency and functionality of semiconductor devices.
- By stacking chips vertically, the technology allows for more compact and integrated semiconductor packages.
- The design enhances the performance and capabilities of electronic devices that use semiconductor chips.
Potential Applications
The technology can be applied in various electronic devices such as smartphones, tablets, computers, and IoT devices. It can also be used in automotive electronics, medical devices, and industrial equipment. The compact design of the chip stack structure enables smaller and more powerful electronic devices.
Problems Solved
The technology addresses the need for more efficient and compact semiconductor packages. It solves the challenge of integrating multiple chips in a limited space. The chip stack structure improves the overall performance and functionality of electronic devices.
Benefits
Increased efficiency and performance of electronic devices. Compact design allows for smaller and more portable devices. Enhanced functionality and capabilities of semiconductor devices.
Commercial Applications
Title: "Innovative Chip Stack Structure for Enhanced Electronic Devices" The technology can be utilized by semiconductor manufacturers to create more advanced and compact electronic devices. It has the potential to revolutionize the design and performance of various consumer electronics and industrial equipment. The market implications include increased demand for smaller, more powerful electronic devices.
Questions about Chip Stack Structure
1. How does the chip stack structure improve the efficiency of semiconductor devices? The chip stack structure allows for more compact and integrated semiconductor packages, leading to improved performance and functionality.
2. What are the potential applications of the semiconductor package containing multiple chip stack structures? The technology can be applied in a wide range of electronic devices, including smartphones, tablets, computers, automotive electronics, and medical devices.
Original Abstract Submitted
The inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical direction.
