18346674. SEMICONDUCTOR DIE STACK STRUCTURE simplified abstract (SK hynix Inc.)

SEMICONDUCTOR DIE STACK STRUCTURE

Organization Name

SK hynix Inc.

Inventor(s)

Sung Kyu Kim of Icheon-si Gyeonggi-do (KR)

Jong Yeon Kim of Icheon-si Gyeonggi-do (KR)

Song Na of Icheon-si Gyeonggi-do (KR)

Sang Hyuk Lim of Icheon-si Gyeonggi-do (KR)

Jong Oh Kwon of Icheon-si Gyeonggi-do (KR)

Jin Woo Park of Icheon-si Gyeonggi-do (KR)

SEMICONDUCTOR DIE STACK STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18346674 titled 'SEMICONDUCTOR DIE STACK STRUCTURE

The semiconductor die stack structure described in the patent application consists of a base die, multiple semiconductor die stack units, and bumps. Each stack unit comprises a lower semiconductor die and an upper semiconductor die, both with a body and a front-side pad structure. The front-side pad structure includes a seed layer and a pad pattern with three portions forming a staircase and a reverse staircase, all made of the same metal.

• The semiconductor die stack structure includes a base die, multiple stack units, and bumps.
• Each stack unit has a lower and upper semiconductor die with a front-side pad structure.
• The front-side pad pattern consists of three portions forming a staircase and a reverse staircase.
• All portions of the front-side pad are made of the same metal.

Potential Applications: - Semiconductor manufacturing - Integrated circuit packaging - Microelectronics industry

Problems Solved: - Improved connectivity in semiconductor die stack structures - Enhanced reliability and performance of integrated circuits

Benefits: - Increased efficiency in semiconductor die stacking - Better signal transmission between stacked dies - Cost-effective manufacturing process

Commercial Applications: Title: "Innovative Semiconductor Die Stack Structure for Enhanced Connectivity" This technology can be utilized in the production of advanced electronic devices, such as smartphones, tablets, and computers, to improve performance and reliability.

Prior Art: There is limited information available on prior art related to this specific semiconductor die stack structure design.

Frequently Updated Research: There is ongoing research in the semiconductor industry to enhance the connectivity and performance of stacked dies in electronic devices.

Questions about Semiconductor Die Stack Structure: 1. How does the front-side pad pattern improve the connectivity between semiconductor dies? 2. What are the potential challenges in implementing this innovative stack structure in mass production?

Original Abstract Submitted

A semiconductor die stack structure includes a base die, a plurality of semiconductor die stack units, and bumps. Each of the plurality of semiconductor die stack units includes a lower semiconductor die and an upper semiconductor die. Each of the lower semiconductor die and the upper semiconductor die includes a body and a front-side pad structure. The front-side pad structure includes a front-side pad seed layer and a front-side pad pattern. The front-side pad pattern includes a first front-side pad portion, a second front-side pad portion, and a third front-side pad portion. The first front-side pad portion and the second front-side pad portion forms a staircase. The first front-side pad portion and the third front-side pad form a reverse staircase. The first front-side pad portion, the second front-side pad portion, and the third front-side pad include a same metal.