18345695. COMPLIANT INSERTS FOR PIN DIPPING PROCESSES (Intel Corporation)
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
Organization Name
Inventor(s)
George Robinson of Chandler AZ (US)
Mohamed Elhebeary of Chandler AZ (US)
Viet Chau of Vancouver WA (US)
Zewei Wang of Chandler AZ (US)
Mukund Ayalasomayajula of Chandler AZ (US)
Suraj Maganty of Chandler AZ (US)
Tingting Gao of Chandler AZ (US)
Andrew Wayne Carlson of Chandler AZ (US)
Khalid Mohammad Abdelaziz of Chandler AZ (US)
Craig Jerome Madison of Gilbert AZ (US)
Edvin Cetegen of Chandler AZ (US)
Joseph Petrini of Gilbert AZ (US)
COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
This abstract first appeared for US patent application 18345695 titled 'COMPLIANT INSERTS FOR PIN DIPPING PROCESSES
Original Abstract Submitted
Compliant inserts for pin dipping processes are disclosed herein. An example apparatus disclosed herein includes a pin array to transfer material to a package substrate of an integrated circuit package, a cover plate, an elastic insert to be disposed between the cover plate and the pin array.
- Intel Corporation
- George Robinson of Chandler AZ (US)
- Mohamed Elhebeary of Chandler AZ (US)
- Divya Jain of Mesa AZ (US)
- Viet Chau of Vancouver WA (US)
- Zewei Wang of Chandler AZ (US)
- Mukund Ayalasomayajula of Chandler AZ (US)
- Suraj Maganty of Chandler AZ (US)
- Tingting Gao of Chandler AZ (US)
- Andrew Wayne Carlson of Chandler AZ (US)
- Khalid Mohammad Abdelaziz of Chandler AZ (US)
- Craig Jerome Madison of Gilbert AZ (US)
- Edvin Cetegen of Chandler AZ (US)
- Joseph Petrini of Gilbert AZ (US)
- H01L23/00
- CPC H01L24/81