18343011. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18343011 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
The semiconductor package described in the patent application consists of several layers and components, including redistribution layers, dies, through-vias, molding materials, and a heat dissipation member.
- The package includes a first redistribution layer, at least one lower die, and a first through-via.
- A first molding material molds the first redistribution layer, lower die, and first through-via.
- A second redistribution layer is placed on the lower die, first through-via, and molding material.
- At least one upper die with a specific thickness is positioned on the second redistribution layer.
- A second through-via and a second molding material are also included in the package.
- A heat dissipation member is placed on the upper die and the second through-via to dissipate heat effectively.
Potential Applications: - This semiconductor package can be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - The package addresses the issue of heat dissipation in electronic devices, ensuring optimal performance and longevity. - It provides a compact and efficient solution for integrating multiple components in a semiconductor package.
Benefits: - Improved thermal management leads to enhanced reliability and performance of electronic devices. - The compact design saves space and allows for more functionality in smaller devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Thermal Management This technology can be utilized in the consumer electronics industry to improve the performance and reliability of smartphones, tablets, and other portable devices. It can also benefit the automotive sector by enhancing the efficiency of electronic systems in vehicles.
Questions about Semiconductor Packaging Technology: 1. How does the specific thickness of the upper die contribute to the overall performance of the semiconductor package? 2. What are the key advantages of using a heat dissipation member in this semiconductor package design?
Original Abstract Submitted
A semiconductor package includes: a first redistribution layer; at least one lower die on the first redistribution layer; a first through-via on the first redistribution layer; a first molding material that molds the first redistribution layer, the at least one lower die, and the first through-via; a second redistribution layer on the at least one lower die, the first through-via, and the first molding material; at least one upper die on the second redistribution layer and having a thickness between 1.2 and 1.7 times, including endpoints, greater than a thickness of the at least one lower die; a second through-via on the second redistribution layer; a second molding material that molds the second redistribution layer, the at least one upper die, and the second through-via; and a heat dissipation member on the at least one upper die and the second through-via, wherein the heat dissipation member contacts the second through-via.
