18342376. IMAGE SENSORS AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
IMAGE SENSORS AND METHODS OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Heegeun Jeong of Suwon-si (KR)
Soongeul Choi of Suwon-si (KR)
IMAGE SENSORS AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18342376 titled 'IMAGE SENSORS AND METHODS OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes an image sensor with a chip structure that includes first and second regions. The chip structure consists of a substrate with a first surface, a second surface, and a recess portion. It also includes multiple photoelectric conversion devices within the substrate. Additionally, there is at least one conductive layer on the sidewall and bottom surface of the recess portion and on the horizontal insulating layer in the second region. A first passivation layer is present on the side surface of the conductive layer in the recess portion and on the conductive layer on the horizontal insulating layer. Finally, a second passivation layer is applied on the side surface of the first passivation layer in the recess portion.
- Image sensor with chip structure including first and second regions
- Substrate with first surface, second surface, and recess portion
- Multiple photoelectric conversion devices within the substrate
- Conductive layer on sidewall and bottom surface of the recess portion and on the horizontal insulating layer in the second region
- First passivation layer on side surface of the conductive layer in the recess portion and on the conductive layer on the horizontal insulating layer
- Second passivation layer on side surface of the first passivation layer in the recess portion
Potential Applications
- Digital cameras
- Mobile phones
- Surveillance systems
- Medical imaging devices
Problems Solved
- Improved image sensor performance
- Enhanced photoelectric conversion efficiency
- Reduction in noise and interference
Benefits
- Higher quality images
- Increased sensitivity to light
- More accurate color reproduction
- Improved overall image sensor performance
Original Abstract Submitted
An image sensor includes a chip structure including first and second regions. The chip structure further includes a substrate having a first surface, a second surface, and a recess portion, a plurality of photoelectric conversion devices included in the substrate, at least one conductive layer on a sidewall and a bottom surface of the recess portion and on the horizontal insulating layer in the second region, a first passivation layer on a side surface of the conductive layer in the recess portion and the conductive layer on the horizontal insulating layer, and a second passivation layer on side surface of the first passivation layer in the recess portion.
