18341142. MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

SUBIN Kim of SUWON-SI (KR)

JUNSU Jeon of SUWON-SI (KR)

JAEHYUN Kang of SUWON-SI (KR)

BYUNGMOO Kim of SUWON-SI (KR)

JOONGWON Jeon of SUWON-SI (KR)

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18341142 titled 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a method of manufacturing a semiconductor device that involves designing a semiconductor device layout using a design rule manual (DRM), performing failure evaluation of the manufactured device, updating the DRM based on the evaluation results, redesigning the layout using the updated DRM, and manufacturing the device with the redesigned layout.

  • Designing semiconductor device layout using a design rule manual (DRM)
  • Performing failure evaluation of the manufactured device
  • Updating the DRM based on evaluation results
  • Redesigning the layout using the updated DRM
  • Manufacturing the device with the redesigned layout

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      1. Potential Applications
  • Semiconductor manufacturing industry
  • Electronics industry
      1. Problems Solved
  • Ensuring semiconductor device reliability
  • Improving manufacturing processes
  • Reducing failure rates
      1. Benefits
  • Enhanced semiconductor device performance
  • Increased manufacturing efficiency
  • Cost savings in production process


Original Abstract Submitted

A method of manufacturing a semiconductor device includes designing a semiconductor device layout using a design rule manual (DRM), in which design rules are recorded, and performing failure evaluation of a failure including at least one gate structure failure of a semiconductor device manufactured using the designed semiconductor device layout. The method further includes updating the DRM by updating the design rules recorded in the DRM, based on a result of the failure evaluation, redesigning the semiconductor device layout using the updated DRM, and manufacturing the semiconductor device using the redesigned semiconductor device layout.