18340733. PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE simplified abstract (QUALCOMM Incorporated)
Contents
PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE
Organization Name
Inventor(s)
Aniket Patil of San Diego CA (US)
Dongming He of San Diego CA (US)
PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18340733 titled 'PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE
The abstract describes a package with multiple integrated devices and interconnects, including an optical integrated device and an optical fiber.
- Package includes a substrate, integrated devices, solder interconnects, encapsulation layer, post interconnects, metallization portion, and optical components.
- First integrated device is connected to the package substrate via solder interconnects and encapsulated.
- Post interconnects are located within the encapsulation layer, with a metallization portion connected to them.
- Second integrated device is coupled to the metallization portion through solder interconnects.
- Optical integrated device and optical fiber are also part of the package.
Potential Applications: - This technology can be used in optical communication systems. - It can be applied in high-speed data transmission devices. - Suitable for use in sensors and medical devices requiring optical components.
Problems Solved: - Provides a compact and efficient way to integrate multiple devices in a package. - Ensures reliable connections between different integrated devices. - Facilitates the use of optical components in electronic systems.
Benefits: - Improved performance and reliability of integrated devices. - Enhanced functionality in optical communication and sensing applications. - Simplified manufacturing processes for complex electronic systems.
Commercial Applications: Title: Advanced Optical Integration Package for High-Speed Data Transmission This technology can be utilized in telecommunications equipment, data centers, medical devices, and industrial sensors. The market implications include increased demand for high-speed data transmission solutions and advanced optical communication systems.
Questions about the technology: 1. How does this technology improve the integration of optical components in electronic systems? 2. What are the advantages of using post interconnects in the encapsulation layer for connecting integrated devices?
Original Abstract Submitted
A package comprising a package substrate; a first integrated device coupled to the package substrate through a first plurality of solder interconnects; an encapsulation layer at least partially encapsulating the first integrated device; a plurality of post interconnects at least partially located in the encapsulation layer; a metallization portion coupled to the plurality of post interconnects; a second integrated device coupled to the metallization portion through a second plurality of solder interconnects; an optical integrated device coupled to the package substrate; and an optical fiber coupled to the optical integrated device.
