18339761. SUBSTRATE TREATING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 SUBSTRATE TREATING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUBSTRATE TREATING APPARATUS
Organization Name
Inventor(s)
SUBSTRATE TREATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18339761 titled 'SUBSTRATE TREATING APPARATUS
Simplified Explanation
The substrate treating apparatus described in the abstract is a machine used for processing substrates by supplying gas, chemical liquid, and heat to the substrate. Here are the key points of the innovation:
- Chamber with a gate for loading and unloading substrates
- Gas supply unit for supplying gas into the chamber
- Spin coater with a spin chuck to support and rotate the substrate
- Cup portion to collect and discharge chemical liquid
- Chemical liquid supply unit for supplying chemical liquid onto the substrate
- Heater between the substrate and gas supply unit to heat the substrate
Potential Applications
The technology can be used in various industries such as semiconductor manufacturing, nanotechnology, and electronics for processing substrates efficiently.
Problems Solved
The apparatus solves the problem of uniform and precise coating of substrates with gas and chemical liquid, as well as providing controlled heating for optimal processing.
Benefits
- Improved substrate processing efficiency - Enhanced coating uniformity and precision - Controlled heating for better results
Potential Commercial Applications
"Advanced Substrate Treatment Technology for Semiconductor Manufacturing"
Possible Prior Art
Prior art may include similar substrate treating apparatus used in industries such as semiconductor manufacturing and nanotechnology.
Unanswered Questions
How does the apparatus handle different types of substrates with varying sizes and shapes?
The abstract does not provide information on the flexibility of the machine to accommodate various substrate sizes and shapes.
What safety measures are in place to prevent accidents or mishaps during substrate processing?
The abstract does not mention any safety features or protocols incorporated into the apparatus to ensure the safety of operators and prevent accidents.
Original Abstract Submitted
A substrate treating apparatus includes a chamber having a gate through which a substrate is loaded into the chamber and unloaded from the chamber, a gas supply unit in an upper portion in the chamber and configured to supply gas into the chamber, a spin coater in a lower portion in the chamber and including a spin chuck configured to support and rotate the substrate on an upper surface thereof and a cup portion extending around the substrate and configured to collect and discharge a chemical liquid from the substrate, a chemical liquid supply unit configured to supply a chemical liquid onto the substrate, and a heater between the substrate and the gas supply unit and configured to heat the substrate.
