18332508. PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kioxia Corporation)
Contents
- 1 PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Takuro Okubo of Yokkaichi Mie (JP)
Hidekazu Hayashi of Yokkaichi Mie (JP)
PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18332508 titled 'PROCESSING APPARATUS USING LASER, METHOD OF LASER LIFT-OFF AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The processing apparatus using laser described in the abstract is designed to hold a substrate and rotate while a laser irradiation apparatus moves in a radial direction to irradiate the substrate with an infrared pulsed laser. The control unit ensures that the distance between laser spots satisfies specific criteria in both the rotation direction and radial direction.
- The apparatus includes a stage for holding and rotating a substrate.
- The laser irradiation apparatus can move in a radial direction.
- A control unit regulates the output of an infrared pulsed laser.
- The distance between laser spots in the rotation and radial directions must meet specific criteria.
Potential Applications
This technology could be used in industries such as semiconductor manufacturing, microelectronics, and materials processing.
Problems Solved
This technology solves the problem of precise and efficient laser processing on substrates by controlling the distance between laser spots.
Benefits
The benefits of this technology include improved accuracy, efficiency, and quality in laser processing applications.
Potential Commercial Applications
One potential commercial application of this technology could be in the production of high-precision electronic components.
Possible Prior Art
Prior art may include similar laser processing apparatuses used in industries such as semiconductor manufacturing and materials processing.
Unanswered Questions
How does this technology compare to traditional laser processing methods?
This article does not provide a direct comparison between this technology and traditional laser processing methods in terms of efficiency, accuracy, and cost-effectiveness.
What are the specific industries that could benefit most from this technology?
The article does not specify which industries could benefit the most from this laser processing apparatus and its capabilities.
Original Abstract Submitted
A processing apparatus using laser according to an embodiment includes a stage configured to hold a substrate and rotate, and a laser irradiation apparatus capable of moving in a radial direction of the rotation. The laser irradiation apparatus includes a control unit configured to control an output of an infrared pulsed laser so that L1/L2 satisfies 1.2 or more and 10 or less when a distance between laser spots adjacent to each other in a rotation direction of the stage is L1 and a distance between laser spots adjacent to each other in the radial direction of the rotation is L2.
