18331977. SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
SANG SUB Song of Suwon-si (KR)
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18331977 titled 'SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
The abstract of this patent application describes a substrate for a semiconductor package that includes specific regions for mounting a semiconductor chip, bonding terminals, plating lines, plating line prohibition, and plating line removal.
- The substrate has a semiconductor chip mounting region for placing the semiconductor chip securely.
- It includes a bonding terminal region with at least one bonding terminal for electrical connections.
- There are plating lines that extend across the semiconductor chip mounting region for enhanced conductivity.
- A plating line prohibition region is located opposite the bonding terminal region to prevent interference.
- A plating line removal region is present between the bonding terminal region and the semiconductor chip mounting region, ensuring electrical isolation of each bonding terminal.
Potential Applications: This technology can be used in the manufacturing of semiconductor packages for various electronic devices such as smartphones, computers, and automotive electronics.
Problems Solved: The substrate design addresses the need for efficient electrical connections and isolation in semiconductor packages, improving overall performance and reliability.
Benefits: Enhanced electrical connectivity, improved signal transmission, and increased reliability of semiconductor packages.
Commercial Applications: This technology can be applied in the semiconductor industry for the production of advanced electronic devices, leading to improved performance and durability in consumer electronics.
Prior Art: Prior research in the field of semiconductor packaging and substrate design can provide valuable insights into similar technologies and innovations.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor packaging technology, substrate design, and electrical connectivity for electronic devices.
Questions about Substrate for Semiconductor Package: 1. How does the plating line removal region contribute to the electrical isolation of bonding terminals? 2. What are the potential challenges in implementing this substrate design in mass production?
Original Abstract Submitted
A substrate for a semiconductor package includes a semiconductor chip mounting region; a bonding terminal region including at least one bonding terminal; at least one plating line extending across the semiconductor chip mounting region; a plating line prohibition region at an opposite side of the bonding terminal region from the semiconductor chip mounting region; and a plating line removal region that is between the bonding terminal region and the semiconductor chip mounting region and is free of a portion of the plating line so that each of the at least one bonding terminal is electrically isolated.
