18330462. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Kioxia Corporation)

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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Organization Name

Kioxia Corporation

Inventor(s)

Haruo Miki of Yokohama (JP)

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract

This abstract first appeared for US patent application 18330462 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Simplified Explanation

The abstract describes a semiconductor device that includes a substrate, two semiconductor chips, a bonding layer, and a member. The first semiconductor chip is placed on the substrate, and the second semiconductor chip is positioned above the first chip, covering it from a perpendicular direction. The bonding layer connects the second surface of the second chip to both the first surface of the substrate and the first chip. The member is located on the outer periphery of the bonding layer.

  • The device includes a substrate, two semiconductor chips, a bonding layer, and a member.
  • The first semiconductor chip is placed on the substrate.
  • The second semiconductor chip is positioned above the first chip, covering it from a perpendicular direction.
  • The bonding layer connects the second surface of the second chip to both the first surface of the substrate and the first chip.
  • The member is located on the outer periphery of the bonding layer.

Potential Applications

  • This semiconductor device can be used in various electronic devices such as smartphones, tablets, and computers.
  • It can be utilized in power electronics, automotive applications, and industrial control systems.

Problems Solved

  • The device provides a compact and efficient way to stack semiconductor chips, saving space and improving performance.
  • It allows for better thermal management and heat dissipation, reducing the risk of overheating.

Benefits

  • The compact design of the device allows for more functionality in smaller electronic devices.
  • Improved thermal management ensures better reliability and longevity of the semiconductor chips.
  • The device offers enhanced performance and efficiency due to the stacked chip configuration.


Original Abstract Submitted

A semiconductor device according to the present embodiment includes a substrate, a first semiconductor chip, a second semiconductor chip, a bonding layer, and a member. The substrate has a first surface. The first semiconductor chip is provided on the first surface. The second semiconductor chip is provided above the first semiconductor chip, has a second surface facing the first surface and the first semiconductor chip, and coats the first semiconductor chip as viewed from a direction substantially perpendicular to the first surface. The bonding layer is provided between the second surface and both the first surface and the first semiconductor chip. The member is provided on at least part of an outer periphery of the bonding layer as viewed from the direction substantially perpendicular to the first surface.

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