18329356. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
- 1 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Chip Connection Structures
- 1.13 Original Abstract Submitted
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Han-Hsiang Huang of Hsinchu (TW)
Chun-Hsien Wen of Hsinchu (TW)
Chih-Wei Chang of Hsinchu (TW)
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18329356 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Simplified Explanation
The method involves connecting a semiconductor chip's connector structures to a redistribution structure, which is then bonded to a carrier substrate through second connector structures.
- Plurality of first connector structures on topmost metallization layer
- Redistribution structure with conductive layers and via structures
- Bonding process for connectors and redistribution structure
- Lateral rotation of via structures during redistribution structure formation
Key Features and Innovation
- Efficient redistribution of connections on semiconductor chips
- Improved bonding process for enhanced connectivity
- Innovative lateral rotation technique for via structures
Potential Applications
This technology can be applied in various semiconductor devices, such as microprocessors, memory chips, and sensors.
Problems Solved
This method addresses the need for efficient and reliable connection structures in semiconductor devices.
Benefits
- Enhanced connectivity and signal transmission
- Improved reliability and performance of semiconductor chips
- Simplified manufacturing process for semiconductor devices
Commercial Applications
- Semiconductor industry for manufacturing advanced electronic devices
- Electronics manufacturing for improved connectivity and performance
Prior Art
Readers can explore prior research on semiconductor chip connection structures and redistribution techniques in the semiconductor industry.
Frequently Updated Research
Stay updated on the latest advancements in semiconductor chip connection technologies and redistribution methods.
Questions about Semiconductor Chip Connection Structures
How does this method improve the efficiency of semiconductor chip connections?
This method enhances connectivity by efficiently redistributing connections on semiconductor chips, improving signal transmission and reliability.
What are the potential applications of this technology beyond semiconductor devices?
This technology can also be applied in various electronic devices that require efficient and reliable connection structures.
Original Abstract Submitted
A method includes providing a semiconductor chip with a plurality of first connector structures disposed on a topmost one of a plurality of metallization layers. The method includes forming a redistribution structure comprising a plurality of conductive layers and a plurality of via structures, adjacent ones of the plurality of conductive layers being connected through at least a corresponding one of the plurality of via structures. The method includes bonding the plurality of first connector structures to the redistribution structure. The method includes bonding the redistribution structure to a carrier substrate through a plurality of second connector structures. Forming the redistribution structure includes laterally rotating a first one of the plurality of via structures around a second one of the plurality of via structures, the first via structure being vertically above the second via structure.
