18328982. INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Ching-Hua Hsieh of Hsinchu (TW)
Hsin Liang Chen of New Taipei (TW)
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18328982 titled 'INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Simplified Explanation: The patent application describes a device with a substrate containing conductive pads, a package component bonded to the pads with solder connectors, and an integrated circuit die within the package component.
Key Features and Innovation:
- Device includes substrate with conductive pads and package component with integrated circuit die.
- Solder connectors bond package component to substrate.
- Die connectors on integrated circuit die are connected to solder connectors and conductive pads.
- First dielectric layer surrounds die connectors and part of solder connectors.
- Second dielectric layer is between first dielectric layer and substrate, surrounding conductive pads.
Potential Applications: This technology can be used in various electronic devices such as smartphones, tablets, and computers.
Problems Solved: This technology addresses the need for efficient and reliable bonding of integrated circuit dies to substrates in electronic devices.
Benefits:
- Improved reliability in electronic devices.
- Enhanced performance due to secure connections.
- Simplified manufacturing process.
Commercial Applications: The technology can be applied in the consumer electronics industry, leading to more reliable and high-performance devices.
Prior Art: Readers can start searching for prior art related to this technology in the field of semiconductor packaging and integrated circuit assembly.
Frequently Updated Research: Stay updated on advancements in semiconductor packaging and integrated circuit assembly for potential improvements in this technology.
Questions about the Technology: 1. What are the potential cost implications of implementing this technology in electronic devices? 2. How does this technology compare to traditional methods of bonding integrated circuit dies to substrates in terms of performance and reliability?
Original Abstract Submitted
An embodiment is a device including a substrate comprising conductive pads, a package component bonded to the conductive pads of the substrate with solder connectors, the package component comprising an integrated circuit die, the integrated circuit die comprising die connectors, one of the solder connectors coupled to each of the die connectors and a corresponding conductive pad of the substrate, a first dielectric layer laterally surrounding each of the die connectors and a portion of the solder connectors, and a second dielectric layer being between the first dielectric layer and the substrate, the second dielectric layer laterally surrounding each of the conductive pads of the substrate.
