18328848. METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING simplified abstract (Samsung Electronics Co., Ltd.)
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METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING
Organization Name
Inventor(s)
METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18328848 titled 'METHOD, APPARATUS, AND SYSTEM WITH INTEGRATED CIRCUIT MANUFACTURING
The abstract describes an integrated circuit (IC) system that includes multiple stacked IC chips and substrates with passive components.
- The system includes a first substrate with passive components and a first power managing IC chip stacked on top.
- A first IC chip group is stacked on top of the first power managing IC chip, including an IC and a control IC chip.
- The control IC chip is configured to control the first IC and a second IC from a second IC chip group.
- The second IC chip group includes the second IC stacked on top of the control IC chip.
- A second power managing IC chip is stacked on top of the second IC chip group, with a second substrate comprising passive components on top.
Potential Applications: - This technology could be used in various electronic devices requiring power management and control capabilities. - It can be applied in IoT devices, smart appliances, and other connected systems.
Problems Solved: - Provides a compact and efficient solution for power management and control in integrated circuits. - Streamlines the design and manufacturing process of complex electronic systems.
Benefits: - Improved power efficiency and control in electronic devices. - Enhanced performance and reliability of integrated circuits. - Simplified integration of multiple IC chips in a single system.
Commercial Applications: Title: Advanced Power Management and Control System for Integrated Circuits This technology has significant commercial potential in the semiconductor industry for developing advanced electronic devices with optimized power management and control capabilities.
Questions about the technology: 1. How does this integrated circuit system improve power efficiency in electronic devices? 2. What are the key advantages of using stacked IC chips for power management and control?
Original Abstract Submitted
An integrated circuit (IC) system including a first substrate comprising passive components, a first power managing IC chip including a first power managing IC stacked on the first substrate, first IC chip group including a IC stacked on top of the first power managing IC chip, a control IC chip, stacked on top of the first IC group, including a control IC configured to control the first IC and a second IC of a second IC chip group, the second IC chip group including the second IC stacked on top of the control IC chip, a second power managing IC chip including a second power managing IC stacked on top of the second IC chip group, and a second substrate comprising passive components stacked on top of the second power managing IC chip.
