18322842. SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Choasub Kim of Suwon-si (KR)

Chung Jin Kim of Suwon-si (KR)

Hyungang Kim of Suwon-si (KR)

Soyeon Seok of Suwon-si (KR)

Jungho Lee of Suwon-si (KR)

Yunkyu Jung of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18322842 titled 'SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

Simplified Explanation

The semiconductor device described in the abstract includes a source structure with a support source layer, gate stack structure, memory channel structure, and separation structure. The support source layer has a first source part for the memory channel structure and a second source part for the separation structure, with the first part at a lower level than the second part.

  • The semiconductor device comprises a source structure with a support source layer, gate stack structure, memory channel structure, and separation structure.
  • The support source layer includes a first source part for the memory channel structure and a second source part for the separation structure, with the first part at a lower level than the second part.

Potential Applications

This technology could be applied in:

  • Memory devices
  • Semiconductor manufacturing

Problems Solved

This technology helps in:

  • Enhancing device performance
  • Improving integration of components

Benefits

The benefits of this technology include:

  • Higher efficiency
  • Better functionality

Potential Commercial Applications

This technology could be used in:

  • Consumer electronics
  • Data storage devices

Possible Prior Art

One possible prior art could be:

  • Semiconductor devices with similar structures

Unanswered Questions

How does this technology impact power consumption in electronic systems?

This article does not address the specific impact of this technology on power consumption in electronic systems.

What are the potential challenges in scaling up the fabrication of these semiconductor devices?

The article does not discuss the potential challenges that may arise in scaling up the fabrication of these semiconductor devices.


Original Abstract Submitted

Disclosed are semiconductor devices, electronic systems including the same, and methods of fabricating the same. The semiconductor device comprises a source structure that includes a support source layer, a gate stack structure on the support source layer, a memory channel structure that penetrates through the gate stack structure and the support source layer, and a separation structure that penetrates through the gate stack structure and the support source layer. The support source layer includes a first source part through which the memory channel structure penetrates, and a second source part through which the separation structure penetrates. A top surface of the first source part is at a level lower than that of a top surface of the second source part.