18320791. BONDING LAYER AND PROCESS simplified abstract (Tokyo Electron Limited)
Contents
BONDING LAYER AND PROCESS
Organization Name
Inventor(s)
Scott Lefevre of Albany NY (US)
Satohiko Hoshino of Koshi City (JP)
Sophia Madelone of Albany NY (US)
Yuji Mimura of Koshi City (JP)
BONDING LAYER AND PROCESS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18320791 titled 'BONDING LAYER AND PROCESS
The abstract of the patent application describes a method involving the bonding of two substrates through a cycloaddition mechanism, forming a triazole moiety-linked layer at the interface.
- Simplified Explanation:
- The method involves bonding two substrates by reacting an alkyne moiety on one surface with an azide moiety on the other surface through a cycloaddition mechanism.
- Key Features and Innovation:
- Formation of a triazole moiety-linked layer at the interface. - Utilization of alkyne and azide moieties for bonding substrates.
- Potential Applications:
- Surface functionalization in materials science. - Bioconjugation in biotechnology. - Drug delivery systems.
- Problems Solved:
- Facilitates strong and specific bonding between substrates. - Enables precise control over surface properties.
- Benefits:
- Enhanced adhesion between substrates. - Versatile application in various fields. - Improved stability and functionality of bonded surfaces.
- Commercial Applications:
- Surface modification in the semiconductor industry. - Production of biochips in biomedicine. - Fabrication of sensors in nanotechnology.
- Prior Art:
- Researchers can explore prior studies on click chemistry and surface modification techniques.
- Frequently Updated Research:
- Stay updated on advancements in click chemistry for surface functionalization.
Questions about the technology: 1. How does the cycloaddition mechanism enhance the bonding between substrates? 2. What are the potential challenges in scaling up this method for industrial applications?
Original Abstract Submitted
A method includes providing a first substrate with a first surface including an alkyne moiety. The method includes providing a second substrate with a second surface including an azide moiety. The method further includes bonding the first substrate to the second substrate. The bonding of the first substrate to the second substrate includes making physical contact between the first surface and the second surface at an interface and chemically reacting the alkyne moiety with the azide moiety through a cycloaddition mechanism, thereby forming a triazole moiety-linked layer at the interface.
