18320455. MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE simplified abstract (SK hynix Inc.)
MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE
Organization Name
Inventor(s)
Jea Hoon Park of Icheon-si (KR)
MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18320455 titled 'MEMORY STACK STRUCTURE INCLUDING POWER DISTRIBUTION STRUCTURES AND A HIGH-BANDWIDTH MEMORY INCLUDING THE MEMORY STACK STRUCTURE
The abstract describes a memory stack structure consisting of multiple memory dies stacked over each other, connected by signal transmission and power distribution structures.
- The memory stack structure includes a base die, bottom memory die, intermediate memory die, and top memory die stacked in that order.
- Signal transmission structure electrically connects all the memory dies to each other.
- First power distribution structure connects the base die to the bottom memory die.
- Second power distribution structure connects the bottom memory die, intermediate memory die, and top memory die to each other.
Potential Applications: - This technology can be used in high-performance computing systems. - It can also be applied in data centers for efficient data storage and processing.
Problems Solved: - Enables compact and efficient memory storage in a stacked configuration. - Facilitates faster data transmission and power distribution within the memory stack.
Benefits: - Increased memory capacity in a smaller footprint. - Enhanced data processing speed and efficiency.
Commercial Applications: Title: "Innovative Memory Stack Structure for High-Performance Computing Systems" This technology can be utilized in servers, supercomputers, and other high-performance computing systems to improve data processing capabilities and overall performance.
Questions about the technology: 1. How does this memory stack structure compare to traditional memory configurations?
- The memory stack structure offers increased memory capacity and faster data processing compared to traditional configurations.
2. What are the potential challenges in implementing this technology in real-world applications?
- Some challenges may include thermal management due to the compact stacking of memory dies and ensuring reliable signal transmission and power distribution.
Original Abstract Submitted
A memory stack structure incudes a base die; a bottom memory die stacked over the base die; an intermediate memory die stacked over the bottom memory die; a top memory die stacked over the intermediate memory die; a signal transmission structure electrically connecting the base die, the bottom memory die, the intermediate memory die, and the top memory die to each other; a first power distribution structure electrically connecting the base die to the bottom memory die; and a second power distribution structure electrically connecting the bottom memory die, the intermediate memory die, and the top memory die to each other.
