18316482. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Kwangok Jeong of Suwon-si (KR)

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18316482 titled 'SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Simplified Explanation

The abstract describes an electronic package with a redistribution wiring layer containing redistribution wiring and a bonding pad. The bonding pad has three plating patterns, with the first pattern made of a first material and having an inclined sidewall. The second and third patterns are made of different materials and have the same diameter no greater than the second diameter of the first pattern.

  • Redistribution wiring layer with redistribution wiring and bonding pad
  • Bonding pad with first, second, and third plating patterns
  • First plating pattern made of first material with inclined sidewall
  • Second plating pattern made of second material
  • Third plating pattern made of third material
  • Second and third plating patterns have same diameter no greater than second diameter of first pattern

Potential Applications

  • Semiconductor packaging
  • Integrated circuits
  • Microelectronics

Problems Solved

  • Improved electrical connections
  • Enhanced signal transmission
  • Miniaturization of electronic devices

Benefits

  • Higher performance
  • Increased reliability
  • Compact design


Original Abstract Submitted

An electronic package includes a redistribution wiring layer having redistribution wiring with a redistribution pad, and a bonding pad on the redistribution pad of the redistribution wiring. The bonding pad includes first, second, and third plating patterns. The first plating pattern is on the redistribution pad, and the first plating pattern includes a first material. Moreover, the first plating pattern has an inclined sidewall so that a diameter of the first plating patter decreases with increasing distance from the redistribution pad so that a first diameter of the first plating pattern adjacent the redistribution pad is greater than a second diameter of the first plating pattern spaced apart from the redistribution pad. The second plating pattern is on the first plating pattern, and the second plating pattern includes a second material different than the first material. The third plating pattern is on the second plating pattern, and the third plating pattern includes a third material different than the second material. Moreover, the second and third plating patterns have a same diameter that is no greater than the second diameter of the first plating pattern.

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