18308891. SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE simplified abstract (SK hynix Inc.)
Contents
- 1 SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE
Organization Name
Inventor(s)
Kang Hun Kim of Icheon-si Gyeonggi-do (KR)
Si Yun Kim of Icheon-si Gyeonggi-do (KR)
Jun Yong Song of Icheon-si Gyeonggi-do (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18308891 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUMP INTERCONNECTION STRUCTURE
Simplified Explanation
The semiconductor package described in the patent application includes a bump interconnection structure connecting a first lead and a second lead on different substrates using a solder layer. The first lead has a stair shape that ascends toward the second lead.
- The semiconductor package includes a bump interconnection structure.
- The first lead and second lead are on different substrates.
- A bump is disposed to face the first lead on the second substrate.
- A solder layer connects the bump and the first lead.
- The first lead has a stair shape that ascends toward the second lead.
Potential Applications
The technology described in this patent application could be applied in various semiconductor packaging applications where precise interconnections are required, such as in microelectronics, sensors, and communication devices.
Problems Solved
This technology solves the problem of establishing reliable and efficient interconnections between leads on different substrates in semiconductor packaging. The stair-shaped lead design helps optimize the connection process and improve overall performance.
Benefits
- Improved reliability of interconnections - Enhanced performance of semiconductor packages - Simplified manufacturing process
Potential Commercial Applications
"Optimizing Interconnections in Semiconductor Packaging: Applications and Benefits"
Possible Prior Art
There may be prior art related to semiconductor packaging interconnection structures, but specific examples are not provided in this patent application.
Unanswered Questions
How does this technology compare to existing interconnection methods in terms of performance and reliability?
The patent application does not provide a direct comparison with existing interconnection methods, so it is unclear how this technology stacks up against current practices.
What are the potential challenges or limitations of implementing this technology in semiconductor packaging production?
The patent application does not address any potential challenges or limitations that may arise during the implementation of this technology in semiconductor packaging production.
Original Abstract Submitted
A semiconductor package includes a bump interconnection structure. The semiconductor package includes a first lead and a second lead spaced apart from each other on a first substrate, a bump disposed to face the first lead in a second substrate, and a solder layer configured to connect the bump and the first lead. The first lead has a stair shape that ascends toward the second lead.
