18302466. SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Chien Hung Liu of Hsinchu County (TW)

Yu-Sheng Chen of Taoyuan City (TW)

Yi Ching Ong of Hsinchu (TW)

Hsien Jung Chen of Tainan City (TW)

Kuen-Yi Chen of Hsinchu City (TW)

Kuo-Ching Huang of Hsinchu City (TW)

Harry-HakLay Chuang of Zhubei City (TW)

Wei-Cheng Wu of Zhubei City (TW)

Yu-Jen Wang of Hsinchu City (TW)

SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18302466 titled 'SEMICONDUCTOR DIE PACKAGE AND METHODS OF FORMATION

Simplified Explanation: The semiconductor die package integrates an inductor-capacitor (LC) semiconductor die with a logic semiconductor die to form a voltage regulator circuit, reducing signal propagation distances and improving efficiency.

Key Features and Innovation:

• Integration of inductors and capacitors into a single semiconductor die
• Direct bonding of LC semiconductor die with logic semiconductor die
• Electrical connection of passive components with logic components to form voltage regulator circuit
• Reduction of parasitic capacitance and inductance in the circuit
• Increased operating efficiency and reduced form factor of the semiconductor die package

Potential Applications: The technology can be applied in various electronic devices requiring voltage regulation, such as mobile phones, laptops, and power supplies.

Problems Solved: The technology addresses issues related to signal propagation distances, efficiency, form factor, and parasitic capacitance and inductance in voltage regulator circuits.

Benefits:

• Improved operating efficiency of voltage regulator circuits
• Reduced form factor of semiconductor die packages
• Enhanced performance of voltage regulator circuits

Commercial Applications: Potential commercial applications include consumer electronics, telecommunications equipment, and industrial power supplies, where efficient voltage regulation is crucial for performance.

Questions about the Technology: 1. How does the integration of passive components into a single semiconductor die improve the efficiency of the voltage regulator circuit? 2. What are the specific advantages of reducing parasitic capacitance and inductance in the circuit?

Frequently Updated Research: Ongoing research in semiconductor packaging and integration technologies may further enhance the performance and efficiency of voltage regulator circuits.

Original Abstract Submitted

A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.