18299368. BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS simplified abstract (HONEYWELL INTERNATIONAL INC.)

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BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

Organization Name

HONEYWELL INTERNATIONAL INC.

Inventor(s)

James L. Tucker of Clearwater FL (US)

Eric E. Vogt of Independence MN (US)

James W, Karcz, Jr. of Plymouth MN (US)

BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18299368 titled 'BONDING LAYER BETWEEN STACKED INTEGRATED CIRCUITS

The semiconductor assembly described in the abstract consists of a first semiconductor with electrical contacts on its upper surface, a second semiconductor adjacent to the first, and a mesh affixed between the two.

  • The mesh has interconnecting struts creating openings that align with the electrical contacts on the first semiconductor.
  • The lower surface of the second semiconductor is connected to the first via the electrical contacts, ensuring electrical continuity.
  • This innovative design allows for efficient electrical connection between the two semiconductors while providing structural support through the mesh.

Potential Applications: - This semiconductor assembly could be used in integrated circuits where multiple semiconductors need to be connected. - It may find applications in electronic devices requiring compact and reliable electrical connections.

Problems Solved: - Provides a solution for establishing electrical connections between adjacent semiconductors in a compact and efficient manner. - Ensures structural integrity and support for the semiconductors through the use of the mesh.

Benefits: - Improved electrical connectivity between semiconductors. - Enhanced structural support for the semiconductor assembly. - Potential for smaller and more reliable electronic devices.

Commercial Applications: Title: Semiconductor Assembly for Enhanced Electrical Connectivity This technology could be utilized in the manufacturing of various electronic devices such as smartphones, tablets, and computers, improving their performance and reliability in a compact form factor.

Questions about Semiconductor Assembly: 1. How does the mesh in the semiconductor assembly contribute to its overall functionality? The mesh in the semiconductor assembly provides structural support while allowing for efficient electrical connections between the semiconductors. 2. What are the potential advantages of using this semiconductor assembly in electronic devices? The semiconductor assembly offers improved electrical connectivity, structural integrity, and the potential for smaller and more reliable electronic devices.


Original Abstract Submitted

A semiconductor assembly including: a first semiconductor having a plurality of electrical contacts extending from an upper surface of the first semiconductor; a second semiconductor adjacent to the first semiconductor; and a mesh disposed between and affixed to the upper surface of the first semiconductor and the lower surface of the second semiconductor. A lower surface of the second semiconductor is electrically connected to the first semiconductor via the plurality of electrical contacts. The mesh comprises a plurality of interconnecting struts defining a plurality of openings, wherein the plurality of openings is configured to receive the plurality of electrical contacts.

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