18297549. AUTOMATIC CONTROL OF SUBSTRATES simplified abstract (Applied Materials, Inc.)
Contents
AUTOMATIC CONTROL OF SUBSTRATES
Organization Name
Inventor(s)
Mauro Cimino of San Jose CA (US)
AUTOMATIC CONTROL OF SUBSTRATES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18297549 titled 'AUTOMATIC CONTROL OF SUBSTRATES
The present technology involves methods and systems for enhancing substrate processing. This includes placing a substrate on a pedestal with multiple heating zones, each having its own heater. The substrate is processed based on an initial recipe with a specific pedestal temperature, and initial feedback on substrate properties is collected and used as input for a control algorithm. A substrate model is generated from modeling tests, which is then provided as input to the control algorithm to adjust heater power or temperature to achieve desired substrate properties in different regions.
- The innovation involves a pedestal with multiple heating zones and independent heaters for precise control of substrate processing.
- Initial feedback on substrate properties is collected and used to adjust processing parameters through a control algorithm.
- A substrate model is generated from testing data to further optimize processing parameters for improved results.
- The technology allows for targeted control of substrate properties in different regions for enhanced processing outcomes.
- Corrections to processing parameters are calculated and executed by a processor running the control algorithm based on feedback and modeling data.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production - LED fabrication - Microelectronics industry
Problems Solved: - Inconsistent substrate processing results - Lack of precise control over substrate properties - Difficulty in optimizing processing parameters for different regions of the substrate
Benefits: - Improved substrate processing accuracy - Enhanced control over substrate properties - Increased efficiency in manufacturing processes - Consistent and reliable results
Commercial Applications: Title: Advanced Substrate Processing System for Precision Manufacturing This technology can be utilized in industries such as semiconductor manufacturing, thin film deposition, and LED fabrication to enhance production processes, improve product quality, and increase overall efficiency. The precise control over substrate properties offered by this system can lead to cost savings and higher yields in manufacturing operations.
Questions about Substrate Processing: 1. How does the use of a substrate model improve processing outcomes? The substrate model generated from testing data allows for more accurate adjustments to processing parameters, leading to improved control over substrate properties and better overall results.
2. What are the advantages of having multiple heating zones with independent heaters in a substrate processing system? Having multiple heating zones with independent heaters enables precise control over temperature gradients on the substrate, allowing for targeted adjustments to achieve desired properties in different regions.
Original Abstract Submitted
The present technology includes methods and systems for improving substrate processing. Methods and systems include disposing a substrate on a pedestal that includes a plurality of heating zones each with an independent heater, processing the substrate according to an initial substrate processing recipe that includes an initial pedestal temperature, collecting initial substrate feedback of one or more substrate properties and providing the data as a first input to a substrate control algorithm. Methods include generating a substrate model based upon one or more modeling tests of the substrate, providing the generated substrate model as a second input to the substrate control algorithm, controlling the heater power or heater temperature to achieve a targeted substrate property in one or more substrate regions. Methods include where the correction is calculated and performed by a processor running the substrate control algorithm based upon the first input and the second input.
