18296691. IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
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IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18296691 titled 'IMAGE SENSOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes a package substrate, an image sensor chip, a transparent substrate, and a dam structure. The image sensor chip has a semiconductor substrate with a pixel array region and a pad region. The pixel array region includes a light receiving region and a light blocking region. Color filters are on the light receiving region, a light blocking pattern is on the light blocking region, micro lenses are on the color filters, and a lens structure surrounds the light receiving region. The dam structure is located on the edge of the image sensor chip and between the image sensor chip and the transparent substrate.
- The semiconductor package includes a package substrate, image sensor chip, transparent substrate, and dam structure.
- The image sensor chip has a pixel array region and a pad region.
- The pixel array region has a light receiving region and a light blocking region.
- Color filters are on the light receiving region of the semiconductor substrate.
- A light blocking pattern is on the light blocking region of the semiconductor substrate.
- Micro lenses are on the color filters.
- A lens structure surrounds the light receiving region.
- The dam structure is located on the edge of the image sensor chip and between the image sensor chip and the transparent substrate.
Potential applications of this technology:
- Image sensors for digital cameras and smartphones
- Medical imaging devices
- Surveillance cameras
- Automotive cameras
Problems solved by this technology:
- Improved image quality by reducing light leakage and improving light reception
- Enhanced color accuracy and image sharpness
- Protection of the image sensor chip from external elements
Benefits of this technology:
- Higher quality and more accurate images
- Improved performance in low light conditions
- Increased durability and reliability of image sensors
Original Abstract Submitted
A semiconductor package includes a package substrate, an image sensor chip on the package substrate, a transparent substrate on the image sensor chip, and a dam structure on an edge of the image sensor chip and between the image sensor chip and the transparent substrate. The image sensor chip includes a semiconductor substrate including a pixel array region and a pad region around the pixel array region, the pixel array region including a light receiving region and a light blocking region between the light receiving region and the pad region, color filters on the light receiving region of the semiconductor substrate, a light blocking pattern on the light blocking region of the semiconductor substrate, micro lenses on the color filters, and a lens structure on the light blocking pattern and surrounding the light receiving region. The dam structure may be on at least a portion of the lens structure.
