18291075. PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD simplified abstract (Resonac Corporation)
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
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PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18291075 titled 'PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
The present disclosure pertains to a photosensitive resin composition for a permanent resist, consisting of an acid-modified vinyl group-containing resin, a photopolymerization initiator, and a photopolymerizable compound with specific ethylenically unsaturated groups.
- The composition includes an acid-modified vinyl group-containing resin (A).
- It also contains a photopolymerization initiator (B).
- The photopolymerizable compound (C) comprises a compound with four or more ethylenically unsaturated groups and another with three or fewer ethylenically unsaturated groups.
Potential Applications: - Semiconductor manufacturing - Printed circuit board production - Microfabrication processes
Problems Solved: - Improved resolution in lithography - Enhanced adhesion properties - Increased durability of resist materials
Benefits: - Higher precision in pattern transfer - Reduced material waste - Enhanced overall efficiency in manufacturing processes
Commercial Applications: Title: Advanced Photosensitive Resin Composition for Microfabrication Processes This technology can be utilized in the semiconductor industry, electronics manufacturing, and other high-precision industries to enhance the quality and efficiency of production processes.
Questions about Photosensitive Resin Composition: 1. How does the composition improve resolution in lithography?
- The composition's specific components enhance the ability to transfer intricate patterns onto substrates with high precision.
2. What are the key benefits of using a photosensitive resin composition in microfabrication processes?
- The benefits include improved adhesion, durability, and overall efficiency in manufacturing processes.
Original Abstract Submitted
The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition including: (A) an acid-modified vinyl group-containing resin; (B) a photopolymerization initiator; and (C) a photopolymerizable compound, in which the photopolymerizable compound includes a photopolymerizable compound having four or more ethylenically unsaturated groups and a photopolymerizable compound having three or fewer ethylenically unsaturated groups.
