18290422. SEMICONDUCTOR PACKAGE simplified abstract (LG INNOTEK CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18290422 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes multiple layers and pads for insulating and connecting components within the package.
- The package consists of a first insulating layer, a first pad, a second pad, and a second insulating layer with an opening.
- The first pad is located on the upper surface of the first insulating layer, while the second pad is spaced apart from the first pad horizontally.
- The second insulating layer is positioned on the first pad and includes an opening that overlaps with the upper surface of the first pad vertically.
- The upper surface of the second pad features a recess that is closer to the lower surface of the first insulating layer than the upper surface of the first pad.
Potential Applications: - This semiconductor package design can be used in various electronic devices such as smartphones, computers, and IoT devices. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides insulation and protection for semiconductor components. - Facilitates efficient electrical connections within the package.
Benefits: - Enhanced reliability and durability of electronic devices. - Improved performance and functionality of semiconductor components.
Commercial Applications: - This technology can be utilized by semiconductor manufacturers, electronics companies, and other industries requiring advanced packaging solutions.
Questions about the technology: 1. How does the design of the semiconductor package contribute to the overall performance of electronic devices? 2. What are the specific advantages of using multiple layers and pads in semiconductor packaging?
Original Abstract Submitted
A semiconductor package according to an embodiment includes a first insulating layer; a first pad disposed on an upper surface of the first insulating layer; a second pad disposed on an upper surface of the first insulating layer and spaced apart from the first pad in a horizontal direction; and a second insulating layer disposed on the first pad and including a first opening overlapping an upper surface of the first pad in a vertical direction, wherein an upper surface of the second pad includes a recess, and wherein the recess of the second pad is closer to a lower surface of the first insulating layer than the upper surface of the first pad.
