18284127. HEAT DISSIPATION IN ULTRASOUND PROBES simplified abstract (KONINKLIJKE PHILIPS N.V.)

HEAT DISSIPATION IN ULTRASOUND PROBES

Organization Name

KONINKLIJKE PHILIPS N.V.

Inventor(s)

Ryan M Manning of Lewistown PA (US)

Dennis Dean Clark of Lewistown PA (US)

John William Myers of Lewistown PA (US)

HEAT DISSIPATION IN ULTRASOUND PROBES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18284127 titled 'HEAT DISSIPATION IN ULTRASOUND PROBES

Simplified Explanation

The ultrasound imaging device described in the patent application includes a housing with an outer surface and an inner surface, an array of acoustic elements for transmitting and receiving ultrasound energy, a heat sink, a heat pipe, and a heat spreader material. The heat generated by the array is absorbed by the heat sink, transferred away from the end of the housing by the heat pipe, and dissipated by the heat spreader material on the inner surface of the housing.

• Array of acoustic elements for transmitting and receiving ultrasound energy
• Heat sink within the housing to absorb heat generated by the array
• Heat pipe within the housing to transfer heat away from the end of the housing
• Heat spreader material on the inner surface of the housing to dissipate heat
• Proximal and distal portions of the heat pipe in thermal contact with the heat sink and heat spreader material
• Proximal and distal portions of the heat pipe have a flattened profile

Potential Applications

The technology described in this patent application could be applied in various medical imaging devices, such as ultrasound machines used for diagnostic purposes.

Problems Solved

This technology helps in preventing overheating of the ultrasound imaging device, which can improve the device's performance and longevity.

Benefits

The benefits of this technology include improved heat dissipation, enhanced device performance, and increased durability.

Potential Commercial Applications

One potential commercial application of this technology could be in the manufacturing of advanced ultrasound imaging devices for medical facilities.

Possible Prior Art

Prior art may include similar heat dissipation techniques used in electronic devices to prevent overheating and improve performance.

How does the heat dissipation system impact the overall size and weight of the ultrasound imaging device?

The article does not provide information on how the heat dissipation system affects the size and weight of the device.

What are the potential cost implications of implementing this heat dissipation technology in ultrasound imaging devices?

The article does not address the potential cost implications of incorporating this heat dissipation technology in the devices.

Original Abstract Submitted

An ultrasound imaging device includes a housing with an outer surface and an inner surface. The outer surface is grasped by a user. The device includes an array of acoustic elements transmitting ultrasound energy and receiving ultrasound echoes. The array is at an end of the housing. The device includes a heat sink within the housing and receiving heat generated by the array. The device includes a heat pipe within the housing and transmitting the heat away from the end of the housing. The device includes a heat spreader material on the inner surface of the housing and dissipating the heat. The distal portion of the heat pipe is in thermal contact with the heat sink and the proximal portion of the heat pipe is in thermal contact with the heat spreader material. The proximal portion and the distal portion have a flattened profde.