18282942. RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

Organization Name

Panasonic Intellectual Property Management Co., Ltd.

Inventor(s)

Masashi Koda of Fukushima (JP)

Akira Irifune of Fukushima (JP)

Mitsuyoshi Nishino of Fukushima (JP)

Hisashi Fujinaga of Fukushima (JP)

Yuuki Hirokawa of Fukushima (JP)

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18282942 titled 'RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

The patent application describes a resin composition that includes a polyfunctional vinyl aromatic copolymer, a curing agent, at least one filler selected from a titanate compound filler and a magnesium oxide filler, and a silica filler. The ratio of the high dielectric constant filler to the silica filler is specified in a certain range.

• The resin composition contains a polyfunctional vinyl aromatic copolymer with repeating units derived from divinyl aromatic and monovinyl aromatic compounds.
• It includes a curing agent and a combination of fillers, such as titanate compound filler, magnesium oxide filler, and silica filler.
• The mass ratio of the high dielectric constant filler to the silica filler falls within the range of 10:90 to 90:10.

Potential Applications

This technology could be used in electronic components, insulation materials, and other applications requiring high dielectric properties.

Problems Solved

The resin composition addresses the need for materials with specific dielectric properties for various industrial applications.

Benefits

The composition offers improved dielectric performance, potentially leading to enhanced product efficiency and reliability.

Commercial Applications

The resin composition could find applications in the electrical and electronics industry, particularly in the manufacturing of capacitors, insulators, and other electronic components.

Prior Art

There may be existing patents or publications related to resin compositions with specific filler combinations for dielectric applications.

Frequently Updated Research

Stay updated on advancements in resin compositions for dielectric materials and their applications in different industries.

Questions about Resin Composition

What are the key advantages of using a resin composition with a specific filler ratio for dielectric applications?

The specific filler ratio in the resin composition can significantly impact the dielectric properties, leading to improved performance in electronic components and insulation materials.

How does the resin composition compare to existing materials in terms of dielectric performance and cost-effectiveness?

Research and testing are essential to determine the competitive advantages of the resin composition compared to other materials in the market.

Original Abstract Submitted

A resin composition contains a polyfunctional vinyl aromatic copolymer (A) containing a repeating unit (a) derived from a divinyl aromatic compound and a repeating unit (b) derived from a monovinyl aromatic compound, a curing agent (B), at least one filler (C) selected from the group consisting of a titanate compound filler (C) and a magnesium oxide filler (C), and a silica filler (D), in which the content ratio of the high dielectric constant filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.