18282929. RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)

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RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

Organization Name

Panasonic Intellectual Property Management Co., Ltd.

Inventor(s)

Akira Irifune of Fukushima (JP)

Mitsuyoshi Nishino of Fukushima (JP)

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18282929 titled 'RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD

The resin composition in this patent application contains a polyphenylene ether compound (A) with specific molecular groups, a curing agent (B), a titanate compound filler (C), and a silica filler (D), with a specific mass ratio between the titanate compound filler and the silica filler.

  • The resin composition includes a unique polyphenylene ether compound with specific molecular groups.
  • It also contains a curing agent, a titanate compound filler, and a silica filler.
  • The ratio of titanate compound filler to silica filler is crucial, ranging from 10:90 to 90:10 as a mass ratio.

Potential Applications: - This resin composition could be used in various industries such as automotive, electronics, and construction for its specific properties. - It may find applications in adhesives, coatings, and sealants due to its unique composition.

Problems Solved: - This resin composition addresses the need for a material with specific properties for various applications. - It provides a solution for enhancing the performance of composite materials in different industries.

Benefits: - Improved mechanical properties and thermal stability. - Enhanced adhesion and compatibility with other materials. - Cost-effective production process.

Commercial Applications: - The resin composition could be utilized in manufacturing high-performance components for automotive and aerospace industries. - It may find applications in the production of electronic devices and construction materials.

Questions about the resin composition: 1. How does the specific ratio of titanate compound filler to silica filler impact the properties of the resin composition? 2. What are the potential challenges in scaling up the production of this resin composition for commercial applications?

Frequently Updated Research: - Stay updated on the latest advancements in resin compositions and fillers to enhance the performance of materials in various industries.


Original Abstract Submitted

A resin composition contains a polyphenylene ether compound (A) having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, a curing agent (B), a titanate compound filler (C), and a silica filler (D), in which the content ratio of the titanate compound filler (C) to the silica filler (D) is 10:90 to 90:10 as a mass ratio.

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