18282708. ADHESIVE TAPE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
Contents
- 1 ADHESIVE TAPE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ADHESIVE TAPE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does this adhesive tape compare to other materials commonly used in semiconductor packaging?
- 1.9.3 What testing or validation has been done to confirm the effectiveness of this adhesive tape in preventing the mentioned issues during semiconductor device packaging?
- 1.10 Original Abstract Submitted
ADHESIVE TAPE
Organization Name
3M INNOVATIVE PROPERTIES COMPANY
Inventor(s)
ADHESIVE TAPE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18282708 titled 'ADHESIVE TAPE
Simplified Explanation
The present invention describes an adhesive tape for semiconductor device packaging that can prevent issues such as chip tilt, packaging material flash, contamination from adhesive residue, lead frame warpage, and more.
- Base film with a coefficient of thermal expansion between 4.5 to 15 ppm/°C
- Adhesive layer made of polyether ether ketone with crystallinity equal to or less than 10% and elastic modulus between 10 and 100 MPa at 150-300°C
Potential Applications
The adhesive tape can be used in the back-end packaging of semiconductor devices to ensure proper adhesion and prevent common issues during the packaging process.
Problems Solved
1. Chip tilt 2. Packaging material flash 3. Contamination from adhesive residue 4. Lead frame warpage
Benefits
1. Improved packaging process for semiconductor devices 2. Enhanced reliability of the packaging 3. Reduction in defects and rework during packaging
Potential Commercial Applications
Optimizing the back-end packaging process of semiconductor devices with the use of this adhesive tape can lead to improved product quality and reliability, making it attractive for semiconductor manufacturers.
Possible Prior Art
There may be existing adhesive tapes used in semiconductor packaging, but the specific combination of materials and properties described in this invention may be novel and not found in prior art.
Unanswered Questions
How does this adhesive tape compare to other materials commonly used in semiconductor packaging?
This article does not provide a direct comparison with other materials or adhesive tapes used in semiconductor packaging. It would be helpful to understand the specific advantages and disadvantages of this new adhesive tape in comparison to existing options.
What testing or validation has been done to confirm the effectiveness of this adhesive tape in preventing the mentioned issues during semiconductor device packaging?
The article does not mention any specific testing or validation procedures conducted to confirm the effectiveness of this adhesive tape. It would be important to know if any real-world testing has been done to support the claims made in the patent application.
Original Abstract Submitted
Provided in the present invention is an adhesive tape, including: a base film, having a coefficient of thermal expansion within a range of 4.5 to 15 ppm/° C.; and an adhesive layer, including polyether ether ketone having a crystallinity equal to or less than 10% and an elastic modulus between 10 and 100 MPa at 150-300° C. The adhesive tape according to the technical solution of the present invention can effectively avoid problems such as chip tilt, packaging material flash, contamination caused by an adhesive residue, lead frame warpage, and the like during back-end packaging of a semiconductor device.
