18279310. LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD THEREOF simplified abstract (BOE Technology Group Co., Ltd.)
Contents
LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD THEREOF
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18279310 titled 'LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND PREPARATION METHOD THEREOF
The present disclosure introduces a light-emitting device, a light-emitting module, and a method for preparing them. The light-emitting device consists of a light-emitting structure, an electrode structure on the light-emitting structure, and a die-bonding structure with a doping material to prevent the formation of an intermetallic compound.
- The light-emitting device includes a unique die-bonding structure with a doping material to inhibit the generation of an intermetallic compound.
- This innovation aims to enhance the die-bonding rework yield and reduce the risk of failure in a display module.
- The electrode structure is covered by the die-bonding structure, providing added protection and stability to the device.
- By incorporating the doping material in the die-bonding structure, the technology ensures improved performance and longevity of the light-emitting device.
- The method of preparation outlined in the disclosure offers a practical approach to manufacturing these innovative light-emitting devices.
Potential Applications: This technology can be applied in various industries such as display manufacturing, lighting systems, and electronic devices requiring efficient light emission.
Problems Solved: The technology addresses issues related to die-bonding rework yield and failure risks in display modules, improving overall device performance and reliability.
Benefits: Enhanced die-bonding rework yield, reduced failure risks, improved device stability, and longevity are some of the key benefits of this technology.
Commercial Applications: This technology has significant commercial potential in the display manufacturing industry, lighting technology sector, and electronic device production market.
Questions about the Technology: 1. How does the doping material in the die-bonding structure inhibit the generation of an intermetallic compound? 2. What specific improvements does this technology offer in terms of device performance and reliability?
Original Abstract Submitted
The present disclosure provides a light-emitting device, a light-emitting module and a preparation method thereof. The light-emitting device includes: a light-emitting structure; an electrode structure provided on the light-emitting structure; and a die-bonding structure, at least a portion of which covers a surface of the electrode structure facing away from the light-emitting structure, where the die-bonding structure includes a doping material for inhibiting generation of an intermetallic compound. The present disclosure is capable of improving the die-bonding rework yield and reducing the risk of failure of a display module.
