18278944. VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED simplified abstract (Telefonaktiebolaget LM Ericsson (publ))
Contents
- 1 VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED
Organization Name
Telefonaktiebolaget LM Ericsson (publ)
Inventor(s)
Marthinus Da Silveira of Ottawa (CA)
Neil Mcgowan of Stittsville (CA)
VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED - A simplified explanation of the abstract
This abstract first appeared for US patent application 18278944 titled 'VERY EFFICIENT 5G/6G ANTENNA ARRAY SYSTEM (AAS) FEED
Simplified Explanation
The patent application describes a radio frequency feedline structure comprising multiple printed circuit boards (PCBs) with metal layers and vias connecting them to create an open channel for a suspended signal path.
- The first PCB has upper and lower metal layers with a cutout defining an upper portion of the open channel, connected by vias on opposite walls of the cutout.
- The second PCB has upper and lower metal layers with elongated slots defining a suspended signal path within the open channel, connected by vias.
- The third PCB has upper and lower metal layers with a cutout defining a lower portion of the open channel, connected by vias on opposite walls of the cutout.
- Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.
Potential Applications
This technology can be applied in:
- Telecommunications equipment
- Antenna systems
- Radar systems
Problems Solved
This technology addresses issues related to:
- Signal interference
- Signal loss
- Signal distortion
Benefits
The benefits of this technology include:
- Improved signal quality
- Enhanced signal transmission efficiency
- Reduced signal loss
Potential Commercial Applications
The potential commercial applications of this technology can be seen in:
- Telecommunications industry
- Aerospace industry
- Defense industry
Possible Prior Art
One possible prior art for this technology could be the use of traditional feedline structures in radio frequency systems.
Unanswered Questions
How does this technology compare to existing feedline structures in terms of signal transmission efficiency?
This article does not provide a direct comparison with existing feedline structures in terms of signal transmission efficiency. Further research or testing may be needed to determine the performance differences between this technology and traditional feedline structures.
What are the potential cost implications of implementing this technology in existing systems?
The article does not discuss the potential cost implications of implementing this technology in existing systems. It would be beneficial to analyze the cost-effectiveness of adopting this technology compared to traditional feedline structures.
Original Abstract Submitted
Embodiments of a radio frequency feedline structure. A first printed circuit board (PCB) includes upper and lower metal layers and at least one cutout defining an upper portion of an open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. A second PCB includes upper and lower metal layers and elongated slots defining a suspended signal path within the open channel. The upper and lower metal layers are electrically connected by vias. A third PCB includes upper and lower metal layers and at least one cutout defining a lower portion of the open channel. The upper and lower metal layers are electrically connected by vias on opposite walls of the cutout. Respective upper and lower ground planes are electrically connected to the upper metal layer of the first PCB and the lower metal layer of the third PCB.