18278928. HIGH FREQUENCY CIRCUIT simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
HIGH FREQUENCY CIRCUIT
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
Suguru Yamagishi of Osaka (JP)
HIGH FREQUENCY CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 18278928 titled 'HIGH FREQUENCY CIRCUIT
The high frequency circuit described in the patent application includes multiple insulating layers, grounds, alternating-current signal lines, and shield vias.
- The circuit consists of a first insulating layer, a second insulating layer stacked on top, a first ground on one surface of the first insulating layer, and a second ground on one surface of the second insulating layer.
- Two alternating-current signal lines are positioned between the insulating layers, with each line having an end portion for signal supply.
- A shield via is included in the circuit for protection and signal integrity.
Potential Applications: This high frequency circuit can be used in telecommunications, radar systems, and high-speed data transmission applications.
Problems Solved: The circuit addresses issues related to signal interference, signal loss, and maintaining signal integrity in high frequency applications.
Benefits: The circuit offers improved signal quality, reduced interference, and enhanced performance in high frequency communication systems.
Commercial Applications: This technology can be utilized in 5G networks, satellite communications, and military radar systems for improved signal transmission and reception.
Questions about High Frequency Circuits: 1. How does the shield via in the circuit contribute to signal integrity?
- The shield via helps to minimize electromagnetic interference and maintain signal quality.
2. What are the key advantages of using multiple insulating layers in high frequency circuits?
- Multiple insulating layers help to reduce signal loss and improve overall circuit performance.
Original Abstract Submitted
A high frequency circuit includes a first insulating layer; a second insulating layer stacked on the first insulating layer directly or with one or more intermediate layers interposed therebetween; a first ground disposed on a first surface that does not face the second insulating layer among the first surface and a second surface forming two surfaces of the first insulating layer; a first line having a first end portion to which a first alternating-current signal is to be supplied and a second line having a second end portion to which a second alternating-current signal is to be supplied that are disposed between the first insulating layer and the second insulating layer; a second ground disposed on a third surface that does not face the first insulating layer among the third surface and a fourth surface forming two surfaces of the second insulating layer; and a first shield via.
