18277654. SEMICONDUCTOR PACKAGE simplified abstract (LG INNOTEK CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18277654 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the abstract includes a first insulating layer and a first through electrode part that passes through the insulating layer in a shape elongated in a first direction. The first through electrode part consists of multiple first through electrodes spaced apart from each other in a direction perpendicular to the first direction and the thickness direction. At least one of these first through electrodes includes a first sub through electrode and a second sub through electrode, both spaced apart from each other in the first direction. Additionally, at least one of the sub through electrodes has a width in the first direction greater than its width in the second direction.
- The semiconductor package features a first insulating layer and a first through electrode part with multiple first through electrodes.
- The first through electrodes are spaced apart in a direction perpendicular to the elongated shape of the electrode part.
- Each first through electrode includes a first sub through electrode and a second sub through electrode.
- The sub through electrodes are spaced apart from each other in the elongated direction of the electrode part.
- At least one of the sub through electrodes has a greater width in the elongated direction than in the perpendicular direction.
Potential Applications: - This technology can be used in various semiconductor devices and integrated circuits. - It can improve the performance and reliability of electronic components.
Problems Solved: - Enhances the connectivity and functionality of semiconductor packages. - Allows for more efficient and reliable electronic systems.
Benefits: - Improved performance and reliability of semiconductor devices. - Enhanced connectivity and functionality in electronic components.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Systems This technology can be utilized in the manufacturing of advanced electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit the aerospace and defense industries by improving the performance and reliability of electronic systems.
Questions about the technology: 1. How does the width difference between the sub through electrodes impact the overall performance of the semiconductor package? 2. What are the specific advantages of having multiple first through electrodes in the semiconductor package design?
Original Abstract Submitted
A semiconductor package according to an embodiment includes a first insulating layer; and a first through electrode part passing through the first insulating layer and having a shape elongated in a first direction; wherein the first through electrode part includes a plurality of first through electrodes spaced apart from each other in a second direction perpendicular to the first direction and a thickness direction; wherein at least one of the plurality of first through electrodes includes a first sub through electrode and a second sub through electrode spaced apart from each other in the first direction; and wherein at least one of the first sub through electrode and the second sub through electrode has a width in the first direction greater than a width in the second direction.
