18275001. PRINTED WIRING BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
- 1 PRINTED WIRING BOARD
PRINTED WIRING BOARD
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
PRINTED WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18275001 titled 'PRINTED WIRING BOARD
Simplified Explanation
The abstract describes a printed wiring board with coil wiring on a base film, including two connection lands and two main surfaces with coil wiring on each.
- The printed wiring board includes a base film with coil wiring, first and second connection lands, and coil wiring on two main surfaces.
- The coil wiring consists of a first coil on one main surface and a second coil on the opposite main surface, with the second coil connected to the first.
- The first and second connection lands are located on the second main surface.
- The first coil has more turns than the second coil.
Potential Applications
This technology could be applied in various electronic devices requiring compact and efficient wiring systems, such as smartphones, tablets, and wearable devices.
Problems Solved
This innovation solves the problem of efficiently connecting coil wiring on different surfaces of a printed wiring board, allowing for more compact and versatile designs.
Benefits
The benefits of this technology include increased efficiency in wiring connections, space-saving design, and improved overall performance of electronic devices.
Potential Commercial Applications
The potential commercial applications of this technology could be in the consumer electronics industry, particularly in the development of smaller and more advanced electronic devices.
Possible Prior Art
One possible prior art could be the use of multi-layer printed circuit boards with coil wiring, but the specific configuration described in this patent application appears to be unique.
Unanswered Questions
How does this technology compare to traditional wiring methods in terms of efficiency and performance?
This technology offers a more compact and efficient solution for connecting coil wiring on different surfaces of a printed wiring board, potentially improving overall performance in electronic devices.
What are the potential challenges in implementing this technology on a larger scale for mass production?
One potential challenge could be ensuring the precise alignment and connection of the coil wiring on the different surfaces of the printed wiring board during the manufacturing process.
Original Abstract Submitted
A printed wiring board includes a base film having a main surface, a coil wiring formed on the main surface, and a first connection land and a second connection land connected to one end and another end of the coil wiring, respectively. The main surface includes a first main surface and a second main surface opposite to the first main surface. The coil wiring includes a first coil wiring formed in a spiral shape on the first main surface, and a second coil wiring formed in a spiral shape on the second main surface and electrically connected to the first coil wiring. The first connection land and the second connection land are formed on the second main surface. The number of turns of the first coil wiring is more than the number of turns of the second coil wiring.
