18274056. ELECTRONIC ELEMENT MOUNTING SUBSTRATE simplified abstract (KYOCERA CORPORATION)
Contents
ELECTRONIC ELEMENT MOUNTING SUBSTRATE
Organization Name
Inventor(s)
Futoshi Onimaru of Kyoto-shi (JP)
Jyoji Kawasaki of Kyoto-shi (JP)
Arata Inomoto of Kyoto-shi (JP)
Atsuo Yamamoto of Kyoto-shi (JP)
ELECTRONIC ELEMENT MOUNTING SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18274056 titled 'ELECTRONIC ELEMENT MOUNTING SUBSTRATE
Simplified Explanation: The patent application describes an electronic element mounting substrate with a unique metal film structure to prevent the unintentional flow of connection material and promote the spreading of the material during mounting of electronic elements.
- The substrate has a mounting region for electronic elements and a first metal film in the mounting region.
- The first metal film has a central region and a thick film portion in the periphery, controlling the flow of connection material.
- This design prevents the connection material from flowing outside the mounting region and enhances the spreading of the material for better connectivity.
Key Features and Innovation:
- Unique metal film structure in the mounting region.
- Central region and thick film portion to control flow of connection material.
- Prevents material from flowing outside the mounting region.
- Promotes spreading of connection material for improved connectivity.
Potential Applications:
- Electronics manufacturing.
- Circuit board assembly.
- Semiconductor industry.
Problems Solved:
- Unintentional flow of connection material.
- Inadequate spreading of connection material.
- Ensuring secure and reliable connections in electronic elements.
Benefits:
- Enhanced connectivity.
- Improved reliability of electronic components.
- Prevents material wastage during assembly.
Commercial Applications: The technology can be utilized in various industries such as electronics manufacturing, semiconductor production, and circuit board assembly to improve the quality and reliability of electronic components.
Questions about Electronic Element Mounting Substrate: 1. How does the unique metal film structure prevent the unintentional flow of connection material? 2. What are the potential applications of this technology in the electronics industry?
Frequently Updated Research: Stay updated on the latest advancements in metal film structures for electronic element mounting substrates to ensure optimal performance and reliability in electronic components.
Original Abstract Submitted
An electronic element mounting substrate including: a substrate having, on an upper surface thereof, a mounting region on which an electronic element is to be mounted; and a first metal film located in the mounting region, in which the first metal film has a first region including a center portion of the first metal film and a second region located in at least a part of a periphery of the first region, and the second region has a thick film portion in which a film thickness of the second region is greater than a film thickness of the first region. Thus, a connection material connecting the mounting region and the electronic element is suppressed from unintentionally flowing to the outside. In addition, spreading of the connection material is promoted.
