18271871. WIRING BOARD simplified abstract (KYOCERA CORPORATION)
Contents
WIRING BOARD
Organization Name
Inventor(s)
Toshifumi Higashi of Kirishima-shi (JP)
Hiroaki Sano of Kagoshima-shi (JP)
Akira Imoto of Kirishima-shi (JP)
Sentarou Yamamoto of Kagoshima-shi (JP)
WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18271871 titled 'WIRING BOARD
- Simplified Explanation:**
The patent application describes a wiring board with an insulation layer made of glass ceramic and an electrical conductor layer composed of copper-containing crystallites. These crystallites have linear sides that form grain boundaries when in contact with each other.
- Key Features and Innovation:**
- Wiring board with glass ceramic insulation layer
- Electrical conductor layer made of copper-containing crystallites
- Crystallites with linear sides forming grain boundaries
- Potential Applications:**
This technology could be used in electronic devices, circuit boards, and other electrical systems that require efficient and reliable wiring connections.
- Problems Solved:**
This technology addresses the need for durable and high-performance wiring boards that can withstand electrical currents and provide stable connections over time.
- Benefits:**
- Improved durability and reliability of wiring boards
- Enhanced electrical conductivity
- Stable connections for electronic devices
- Commercial Applications:**
Potential commercial applications include the manufacturing of electronic devices, telecommunications equipment, and automotive electronics. This technology could also be used in aerospace and defense industries for reliable wiring connections.
- Prior Art:**
Readers interested in prior art related to this technology could explore patents and research papers on glass ceramic insulation materials, copper-based electrical conductors, and wiring board manufacturing processes.
- Frequently Updated Research:**
Researchers may be conducting studies on enhancing the electrical conductivity of copper-containing crystallites, optimizing the manufacturing process of wiring boards, and exploring new materials for insulation layers.
- Questions about Wiring Boards:**
1. What are the key advantages of using glass ceramic as an insulation material in wiring boards?
Glass ceramic offers high thermal stability, excellent electrical insulation properties, and resistance to chemical corrosion, making it ideal for wiring board applications.
2. How do copper-containing crystallites improve the performance of electrical conductor layers in wiring boards?
Copper-containing crystallites provide high electrical conductivity and mechanical strength, ensuring reliable connections in wiring boards.
Original Abstract Submitted
A wiring board includes an insulation layer and an electrical conductor layer that are layered. The insulation layer is a glass ceramic. The electrical conductor layer is a sintered body of a plurality of crystallites containing copper as a main component. The plurality of crystallites include polygonal crystallites having linear sides. The plurality of crystallites are in contact with each other via the linear sides as grain boundaries.
