18269172. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR simplified abstract (LG INNOTEK CO., LTD.)
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
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SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 18269172 titled 'SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
The semiconductor package described in the patent application consists of a printed circuit board with a connection portion, an IC chip mounted on the board, a solder portion on the lower surface of the IC chip connected to the connection portion, a bonding layer between the solder portion and the connection portion, and an underfill between the IC chip and the printed circuit board. The bonding layer contains thermosetting resin, while the underfill contains thermoplastic resin.
- The semiconductor package includes a printed circuit board with a connection portion.
- An IC chip is positioned on the printed circuit board.
- A solder portion is located on the lower surface of the IC chip and is connected to the connection portion.
- A bonding layer is present between the solder portion and the connection portion, containing thermosetting resin.
- An underfill is placed between the IC chip and the printed circuit board, consisting of thermoplastic resin.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Ensures secure connections between the IC chip and the printed circuit board. - Provides stability and reliability in electronic devices. - Enhances the overall performance and longevity of the semiconductor package.
Benefits: - Improved durability and resistance to external factors. - Enhanced electrical conductivity and signal transmission. - Cost-effective manufacturing process.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the production of consumer electronics, automotive electronics, medical devices, and industrial machinery, leading to more reliable and efficient products in the market.
Prior Art: Readers can explore prior patents related to semiconductor packaging, thermosetting resin, and thermoplastic resin to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Stay updated on the latest developments in semiconductor packaging materials, bonding techniques, and underfill technologies to ensure the continued improvement of electronic devices.
Questions about Semiconductor Packaging Technology: 1. How does the bonding layer contribute to the reliability of the semiconductor package? The bonding layer with thermosetting resin ensures a strong and stable connection between the solder portion and the connection portion, enhancing the overall reliability of the semiconductor package.
2. What are the key differences between thermosetting resin and thermoplastic resin in semiconductor packaging? Thermosetting resin hardens irreversibly when heated, providing a strong bond, while thermoplastic resin softens when heated and hardens upon cooling, allowing for reworkability and flexibility in the manufacturing process.
Original Abstract Submitted
A semiconductor package comprises: a printed circuit board including a connection portion; an IC chip arranged on the printed circuit board; a solder portion arranged on the lower surface of the IC chip and coupled to the connection portion; a. bonding layer arranged between the solder portion and the connection portion; and an underfill arranged between the IC chip and the printed circuit board, wherein the bonding layer includes thermosetting resin, and the underfill include thermoplastic resin.
