18265578. BONDED CONNECTION MEANS simplified abstract (Siemens Aktiengesellschaft)
Contents
- 1 BONDED CONNECTION MEANS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDED CONNECTION MEANS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BONDED CONNECTION MEANS
Organization Name
Inventor(s)
PHILIPP Kneissl of Nürnberg (DE)
MARKUS Pfeifer of Nürnberg (DE)
BONDED CONNECTION MEANS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18265578 titled 'BONDED CONNECTION MEANS
Simplified Explanation
The semiconductor module described in the patent application includes a semiconductor element, a substrate, and a bond connector designed as a gate resistor, shunt, resistor in an RC filter, or fuse. The bond connector consists of a core made of a first metal material and a jacket made from a second metal material that is different from the first metal material, with the first metal material having a lower electrical conductivity than the second metal material. At least one of the semiconductor element and the substrate is connected to the bond connector.
- The semiconductor module includes a semiconductor element, a substrate, and a bond connector.
- The bond connector is designed as a gate resistor, shunt, resistor in an RC filter, or fuse.
- The bond connector consists of a core made of a first metal material and a jacket made from a second metal material.
- The first metal material has a lower electrical conductivity than the second metal material.
- At least one of the semiconductor element and the substrate is connected to the bond connector.
Potential Applications
The technology described in this patent application could be applied in various electronic devices and systems where precise control of electrical conductivity and resistance is required.
Problems Solved
This technology solves the problem of efficiently connecting semiconductor elements to substrates while providing specific electrical characteristics such as resistance and conductivity.
Benefits
The benefits of this technology include improved performance and reliability of semiconductor modules, precise control over electrical properties, and potentially cost-effective manufacturing processes.
Potential Commercial Applications
The technology could find applications in the semiconductor industry for the production of advanced electronic components, in the automotive sector for improved circuit protection, and in consumer electronics for enhanced device performance.
Possible Prior Art
One possible prior art could be the use of traditional bond connectors made of a single metal material with uniform electrical conductivity, without the specific design features described in this patent application.
Unanswered Questions
How does the specific combination of metal materials in the bond connector contribute to the overall performance of the semiconductor module?
The specific combination of metal materials in the bond connector affects the electrical conductivity and resistance properties, but the exact impact on the overall performance of the semiconductor module is not explicitly discussed in the abstract.
Are there any limitations or challenges in implementing this technology in mass production of semiconductor modules?
While the benefits of the technology are highlighted, potential limitations or challenges in scaling up production or integrating it into existing manufacturing processes are not addressed in the abstract.
Original Abstract Submitted
A semiconductor module includes a semiconductor element, a substrate, and a bond connector designed as a gate resistor, shunt, resistor in an RC filter or fuse. The bond connector includes a core made of a first metal material and a jacket which is designed to envelope the core and made from a second metal material that is different from the first metal material, with the first metal material having an electrical conductivity which is lower than an electrical conductivity of the second metal material. At least one of the semiconductor element and the substrate is connected to the bond connector.
