18264790. SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD simplified abstract (SONY SEMICONDUCTOR SOLUTIONS CORPORATION)
Contents
- 1 SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD
Organization Name
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Inventor(s)
TAKUSHI Shigetoshi of KANAGAWA (JP)
SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18264790 titled 'SEMICONDUCTOR DEVICE, IMAGING DEVICE, AND MANUFACTURING METHOD
Simplified Explanation
The present technology is related to a semiconductor device, an imaging device, and a manufacturing method capable of forming a via connected to wirings at different depths so as not to cause a defect.
- The innovation involves a semiconductor device that allows for the formation of vias connected to wirings at different depths, preventing defects.
- An imaging device is also part of this technology, enhancing the performance and functionality of the device.
- The manufacturing method outlined ensures the proper formation of vias without causing any defects in the process.
Potential Applications
This technology could be applied in the fields of semiconductor manufacturing, imaging technology, and electronic devices.
Problems Solved
This technology addresses the issue of defects caused by the formation of vias connected to wirings at different depths in semiconductor devices.
Benefits
The benefits of this technology include improved performance, enhanced functionality, and reduced defects in semiconductor devices and imaging technology.
Potential Commercial Applications
The potential commercial applications of this technology include semiconductor manufacturing companies, imaging device manufacturers, and electronic device producers.
Possible Prior Art
One possible prior art could be the use of traditional methods for forming vias in semiconductor devices, which may not address the issue of defects caused by connections at different depths.
Unanswered Questions
How does this technology compare to existing methods in terms of cost-effectiveness?
The article does not provide information on the cost-effectiveness of implementing this technology compared to traditional methods.
What are the specific technical specifications of the semiconductor and imaging devices using this technology?
The article does not delve into the technical specifications of the semiconductor and imaging devices utilizing this innovation.
Original Abstract Submitted
The present technology relates to a semiconductor device, an imaging device, and a manufacturing method capable of forming a via connected to wirings at different depths so as not to cause a defect.
