18264784. IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Sony Group Corporation)
Contents
- 1 IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
Tomohiro Sugiyama of Kanagawa (JP)
IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18264784 titled 'IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The abstract describes an imaging device that can suppress defects caused by a passivation film. The device includes a substrate, a pixel circuit, a through silicon via, and a passivation film containing silicon.
- Pixel circuit provided on the substrate
- Through silicon via electrically connected to the pixel circuit
- Passivation film covering the through silicon via and containing silicon
Potential Applications
The technology can be applied in various imaging devices such as cameras, medical imaging equipment, and industrial inspection systems.
Problems Solved
1. Suppressing defects caused by passivation films 2. Ensuring the reliability and longevity of imaging devices
Benefits
1. Improved image quality 2. Enhanced device performance 3. Increased durability and reliability
Potential Commercial Applications
Optimizing Imaging Devices with Passivation Film Suppression Technology
Possible Prior Art
There may be prior art related to passivation film technologies in imaging devices, but specific examples are not provided in the abstract.
Unanswered Questions
How does the passivation film containing silicon contribute to defect suppression in the imaging device?
The abstract mentions that the passivation film contains silicon, but it does not elaborate on how this element helps in suppressing defects. Further details on the mechanism would provide a clearer understanding of the innovation.
Are there any limitations or drawbacks associated with the use of passivation films in imaging devices?
While the abstract highlights the benefits of the technology, it does not mention any potential limitations or drawbacks that may arise from implementing passivation films. Understanding these aspects would be crucial for a comprehensive evaluation of the innovation.
Original Abstract Submitted
An imaging device capable of suppressing at least one of defects caused by a passivation film is provided. An imaging device according to an embodiment of the present disclosure includes a substrate, a pixel circuit provided on the substrate, a through silicon via that penetrates the substrate and is electrically connected to the pixel circuit, and a passivation film that covers the through silicon via. The passivation film contains at least silicon.
