18263435. PLATING METHOD AND PLATING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
- 1 PLATING METHOD AND PLATING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PLATING METHOD AND PLATING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Commercial Applications
- 1.9 Questions about the Technology
- 1.10 Original Abstract Submitted
PLATING METHOD AND PLATING APPARATUS
Organization Name
Inventor(s)
Takeshi Nagao of Kikuchi-gun, Kumamoto (JP)
Yuichiro Inatomi of Kikuchi-gun, Kumamoto (JP)
Kazutoshi Iwai of Kikuchi-gun, Kumamoto (JP)
PLATING METHOD AND PLATING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18263435 titled 'PLATING METHOD AND PLATING APPARATUS
Simplified Explanation
The patent application describes a plating method involving a preparation process, a first plating process, and a second plating process. The method involves preparing a substrate with a seed layer of cobalt or a cobalt alloy in a recess, performing displacement plating to replace the seed layer with copper, and then conducting reduction plating on the recess.
- The method involves preparing a substrate with a seed layer of cobalt or a cobalt alloy in a recess.
- Displacement plating is performed to replace the seed layer with copper using a first plating liquid.
- Reduction plating is then carried out on the recess using a second plating liquid containing a copper ion and a reducing agent.
Potential Applications
This plating method can be used in various industries such as electronics, automotive, and aerospace for coating substrates with copper layers.
Problems Solved
This method addresses the need for efficient and precise plating processes to create copper layers on substrates with seed layers of cobalt or cobalt alloys.
Benefits
The method provides a reliable way to plate substrates with copper layers, ensuring good adhesion and uniformity of the coating. It also offers cost-effective and time-saving benefits compared to traditional plating methods.
Commercial Applications
- Electronics industry for circuit board manufacturing
- Automotive industry for coating components
- Aerospace industry for creating conductive layers on parts
Questions about the Technology
How does this plating method improve upon existing techniques?
This plating method offers a more controlled and efficient way to deposit copper layers on substrates with seed layers of cobalt or cobalt alloys, ensuring better adhesion and uniformity.
What are the potential cost savings associated with using this plating method?
By reducing the need for multiple plating steps and minimizing material waste, this method can lead to cost savings in the manufacturing process.
Original Abstract Submitted
A plating method includes a preparation process; a first plating process; and a second plating process. In the preparation process, a substrate W having a seed layer of cobalt or a cobalt alloy formed in a recess is prepared. In the first plating process, a displacement plating processing is performed on the substrate W to replace a surface layer of the seed layer with copper by using a first plating liquid L containing a copper ion. In the second plating process, after the first plating process, a reduction plating processing is performed on the recess of the substrate W by using a second plating liquid L containing a copper ion and a reducing agent.
