18255998. PRESSURE-SENSITIVE ADHESIVE simplified abstract (LG CHEM, LTD.)
Contents
PRESSURE-SENSITIVE ADHESIVE
Organization Name
Inventor(s)
Hyun Cheol Kim of Daejeon (KR)
Seung Yeon Ryu of Daejeon (KR)
PRESSURE-SENSITIVE ADHESIVE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18255998 titled 'PRESSURE-SENSITIVE ADHESIVE
Simplified Explanation:
The patent application describes a pressure-sensitive adhesive applied to a flexible device that can respond effectively to repeated deformation and recovery without causing defects.
Key Features and Innovation:
- Pressure-sensitive adhesive for flexible devices
- Resilient to repeated deformation and recovery
- No defects such as deformation traces
- Excellent cuttability and workability
- Prevents lifting, delamination, and bubble generation
Potential Applications: The technology can be used in the manufacturing of flexible electronic devices, medical devices, wearable technology, and automotive applications.
Problems Solved: The technology addresses the issue of maintaining adhesive integrity and performance in flexible devices subjected to repeated deformation.
Benefits:
- Enhanced durability and performance of flexible devices
- Improved user experience with no defects or lifting issues
- Increased reliability in various applications
Commercial Applications: The pressure-sensitive adhesive technology can be utilized in the production of flexible displays, sensors, medical patches, and automotive interior components.
Questions about Pressure-Sensitive Adhesive Technology: 1. How does the pressure-sensitive adhesive technology improve the performance of flexible devices? 2. What are the key advantages of using this adhesive in wearable technology applications?
Frequently Updated Research: Stay updated on the latest advancements in pressure-sensitive adhesive technology for flexible devices to ensure optimal performance and reliability.
Original Abstract Submitted
A pressure-sensitive adhesive, which is applied to a flexible device, thereby effectively responding to repeated deformation and recovery, causing no defects (for example, observation of deformation traces and the like) before and after deformation, having excellent cuttability and workability, and causing no lifting, delamination, and/or bubble generation, and a use thereof are provided.
