18249473. METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS simplified abstract (Rohm Co., Ltd.)
Contents
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
Organization Name
Inventor(s)
Koshun Saito of Kyoto-shi, Kyoto (JP)
Kota Ise of Kyoto-shi, Kyoto (JP)
Kosuke Yamada of Kyoto-shi, Kyoto (JP)
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18249473 titled 'METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS
Simplified Explanation
The semiconductor device manufacturing method described in the abstract involves several steps to prepare, mount, and cure semiconductor elements on leadframes using conductive pastes. Here is a simplified explanation of the process:
- First preparation step: Prepare a leadframe with an island part.
- Second preparation step: Prepare a semiconductor element with electrodes.
- Mounting step: Mount the semiconductor element on the leadframe with conductive paste.
- Third preparation step: Prepare a second leadframe with connecting parts.
- Placing step: Place the second leadframe on the semiconductor element with more conductive paste.
- Curing step: Harden the pastes to secure the connections.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics industry
- Automotive industry
Problems solved by this technology:
- Efficient and reliable mounting of semiconductor elements
- Improved electrical connections in semiconductor devices
Benefits of this technology:
- Enhanced performance of semiconductor devices
- Cost-effective manufacturing process
- Increased reliability of electronic components
Potential commercial applications of this technology:
- Production of integrated circuits
- Manufacturing of electronic sensors
- Development of power semiconductor devices
Possible prior art:
- Traditional methods of mounting semiconductor elements on leadframes using soldering techniques
Unanswered questions:
- How does the curing step affect the overall durability of the semiconductor device?
The curing step is crucial in ensuring the stability and longevity of the connections between the semiconductor element and the leadframe. However, the specific impact of the curing process on the durability of the device is not explicitly discussed in the abstract.
- What are the specific properties of the conductive pastes used in this manufacturing method?
While the abstract mentions the use of conductive pastes to mount and connect the semiconductor elements, it does not provide detailed information about the composition or characteristics of these pastes. Understanding the properties of the pastes could shed light on their effectiveness in the manufacturing process.
Original Abstract Submitted
A semiconductor device manufacturing method includes a first preparation step, a second preparation step, a mounting step, a third preparation step, a placing step and a curing step. In the first preparation step, a first leadframe including an island part is prepared. In the second preparation step, a semiconductor element including an element obverse surface, an element reverse surface, a first electrode and a second electrode is prepared. In the mounting step, the semiconductor element is mounted on the island part with a first conductive paste interposed between the element reverse surface and the island part. In the third preparation step, a second leadframe including a first part, a second part, a frame part, a first connecting part and a second connecting part is prepared. In the placing step, the second leadframe is placed with a second conductive paste interposed between the first part and the first electrode and with a third conductive paste interposed between the second part and the second electrode. In the curing step, the first conductive paste, the second conductive paste and the third conductive paste are hardened.
