18244716. DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE simplified abstract (GOOGLE LLC)

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DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

Organization Name

GOOGLE LLC

Inventor(s)

Nam Hoon Kim of San Jose CA (US)

Teckgyu Kang of Saratoga CA (US)

Scott Lee Kirkman of Menlo Park CA (US)

Woon-Seong Kwon of Santa Clara CA (US)

DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18244716 titled 'DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE

Simplified Explanation

The abstract describes a patent application related to deep trench capacitors embedded in a package substrate for an integrated circuit. The chip package includes an integrated circuit die with a power distribution circuit and a substrate with one or more cavities. Deep trench capacitors are placed in these cavities and connected to the power distribution circuit.

  • The patent application is about deep trench capacitors embedded in a package substrate for an integrated circuit.
  • The chip package includes an integrated circuit die with a power distribution circuit.
  • The substrate used in the chip package is different from the integrated circuit and has one or more cavities.
  • The cavities can be formed on either the first surface or the second surface of the substrate.
  • One or more deep trench capacitors are placed in these cavities.
  • The deep trench capacitors are connected to the power distribution circuit using conductors.

Potential Applications

  • This technology can be applied in various electronic devices that use integrated circuits, such as smartphones, tablets, and computers.
  • It can be used in power management systems to improve the efficiency and stability of power distribution in integrated circuits.
  • The deep trench capacitors can be utilized in high-performance computing systems to enhance the overall performance and reliability.

Problems Solved

  • The technology solves the problem of power distribution in integrated circuits by providing deep trench capacitors embedded in the package substrate.
  • It addresses the need for improved power management and stability in electronic devices.
  • The use of deep trench capacitors helps to reduce noise and improve signal integrity in integrated circuits.

Benefits

  • The integration of deep trench capacitors in the package substrate simplifies the design and manufacturing process of integrated circuits.
  • It improves the power distribution efficiency and stability, leading to better overall performance of electronic devices.
  • The use of deep trench capacitors helps to reduce noise and improve the reliability of integrated circuits.


Original Abstract Submitted

This disclosure relates to deep trench capacitors embedded in a package substrate on which an integrated circuit is mounted. In some aspects, a chip package includes an integrated circuit die that has a power distribution circuit for one or more circuits of the integrated circuit. The chip package also includes a substrate different from the integrated circuit and having a first surface on which the integrated circuit die is mounted and a second surface opposite the first surface. The substrate includes one or more cavities formed in at least one of the first surface or the second surface. The chip package also includes one or more deep trench capacitors disposed in at least one of the one or more cavities. Each deep trench capacitor is connected to the power distribution circuit by conductors.

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