18244180. SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY (Applied Materials, Inc.)
Contents
SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY
Organization Name
Inventor(s)
Vijay D. Parkhe of San Jose CA (US)
SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY
This abstract first appeared for US patent application 18244180 titled 'SUBSTRATE SUPPORT ASSEMBLY WITH IMPROVED THERMAL UNIFORMITY
Original Abstract Submitted
Methods for improving thermal uniformity on a surface of a substrate support assembly. One method includes temporarily clamping a ceramic puck plate to a cooling plate of a substrate support assembly with one or more layers of bonding material between the ceramic puck and the cooling plate. The method further includes heating the ceramic puck plate to a target temperature, cooling the cooling plate to an operating temperature, and recording temperatures at a plurality of locations on a substrate support surface of the ceramic puck plate. The method further includes modifying, based on the recorded temperatures, one or more properties of the one or more layers of the bonding material to achieve a target temperature profile on the substrate support surface.
